DuPont's GreenTape LTCC based AiP can replace PCB antennas for 5G

DuPont Microcircuit and Component Materials (MCM) and ITRI in Taiwan are collaborating in bringing a new material GreenTape LTCC (Low Temperature Co-fired Ceramics) material to market for use in AiP (Antenna in Package) applications as an alternative to existing Print Circuit Board (PCB) options. DuPont Microcircuit and Component Materials (MCM) is a maker of of printable, stretchable, and thermoformable functional inks and pastes. Industrial Technology Research Institute (ITRI) is a research institute which has incubated startups and spinoffs such as UMC and TSMC. These partners have unveiled a video of the technology at Del Mar Electronics & Manufacturing Show (DMEMS) 2022 held from May 4 to May 5, 2022. GreenTape LTCC and Argentum conductive pastes are used to form radio frequency components, substrates, and Antenna in Package for Radio Frequency Front End Modules in 5G mmWave small cells/peripherals. Dupont MCM says the LTCC system offers advantages of higher reliability, excellent electrical performance, good thermal conductivity and outstanding environmental resistance. “We’re honored to collaborate with ITRI to demonstrate the value of DuPont MCM GreenTape LTCC systems for Antenna in Package applications. To achieve better efficiency and lower power consumption in the antenna array and Radio Frequency Front End module, RF circuit design and low loss material ...