https://www.eeherald.com/section/news/p1792651466355nwn2globalelectr EE Herald en 2026-10-22T06:45:12.000Z Global Electronics Association Hosts IMPACT 2026 Session on Package-to-Board Integration Global Electronics Association, IMPACT 2026, package-to-board integration, AI and high-performance computing, advanced electronic packaging https://www.eeherald.com/section/new-products/p1792651206705nwn2tdkintroduce EE Herald en 2026-10-22T06:41:01.000Z TDK Introduces B3201*A5/B5/C5 Y1 Safety Capacitors for 500 V AC Automotive and Industrial Applications TDK Corporation, B3201*A5/B5/C5, Y1 safety capacitors, EMI suppression, xEV power electronics, on-board chargers https://www.eeherald.com/section/new-products/p1792651109030nwn2mitsubishiel EE Herald en 2026-10-22T06:39:14.000Z Mitsubishi Electric Develops Humanoid Robot-CNC Machining System for Machine Shops Mitsubishi Electric Corporation, physical AI, CNC machine tools, AI machining task planner, general-purpose humanoid robot, JIMTOF 2026 https://www.eeherald.com/section/news/p1792650906938nwn2accelleraapp EE Herald en 2026-10-22T06:37:00.000Z Accellera Approves Functional Safety Language Standard 1.0 for Safety-Critical Systems Accellera, Functional Safety Language (FSL) Standard 1.0, FMEDA data, ISO 26262, IEC 61508, functional safety workflows https://www.eeherald.com/section/news/p1792650706222nwn2preferrednet EE Herald en 2026-10-22T06:32:43.000Z Preferred Networks and Tenstorrent Selected for NEDO Photonics-Electronics AI Processor R&D Project Preferred Networks, Tenstorrent, AI processors, photonics-electronics integration, confidential computing, AI chiplets https://www.eeherald.com/section/news/p1792650552093nwn2nokiaadvance EE Herald en 2026-10-22T06:30:12.000Z Nokia Advances AI-RAN and Launches Agentic AI Platform With NVIDIA for Telco Autonomy Nokia, AI-RAN, NVIDIA Aerial RAN Computer, Nokia AI-native anyRAN software, sovereign agentic AI platform, physical-AI applications https://www.eeherald.com/section/news/p1792650282780nwn2semiforecast EE Herald en 2026-10-22T06:25:46.000Z SEMI Forecasts 11.8% Growth in Silicon Wafer Shipments in 2026, With Record Highs Through 2029 SEMI, silicon wafer shipments, AI-related demand, advanced epitaxial wafers, high-bandwidth memory (HBM), 17 034 MSI https://www.eeherald.com/section/new-products/p1792648818223nwn2renesaslaunc EE Herald en 2026-10-22T06:03:10.000Z Renesas Launches RX74M and RX74N 22nm MRAM MCUs for Industrial Equipment Renesas Electronics Corporation, RX74M, RX74N, 22nm process, embedded MRAM, industrial automation, EtherCAT, post-quantum cryptography (PQC) https://www.eeherald.com/section/news/p1792579487311nwn2socionextapp EE Herald en 2026-10-21T10:46:00.000Z Socionext Applies Cadence InnoStack AI Super Agent to 3nm SoC Physical Design Socionext, Cadence InnoStack AI Super Agent, agentic AI, large-scale 3nm SoC, physical design, retrieval-augmented generation (RAG) https://www.eeherald.com/section/new-products/p1792575895755nwn2muratadevelo EE Herald en 2026-10-21T09:45:54.000Z Murata Develops World's Smallest 008004-Inch NTC Thermistor Sensors