https://www.eeherald.com/section/news/p1792059415958nwn2tsmcreportst EE Herald en 2026-10-15T10:20:18.000Z TSMC 3Q 2026 Revenue Hits NT$1,494.24 Billion with a 17.6% QoQ growth; 2nm Reaches 8% TSMC, third quarter, diluted earnings per share, 2-nanometer, 3-nanometer, advanced technologies, fourth quarter 2026 https://www.eeherald.com/section/news/p1792028918070nwn2ibmandsiemen EE Herald en 2026-10-15T01:54:26.000Z IBM and Siemens Collaborate on Research to Advance Nanostack Architecture IBM,Siemens,nanostack architecture,7 angstrom node,electronic design automation (EDA),virtual models of nanostack https://www.eeherald.com/section/news/p1792028900957nwn2globalfoundr EE Herald en 2026-10-15T01:54:24.000Z GlobalFoundries Selected to Operate Two New Semiconductor Fabs in New York GlobalFoundries,two new semiconductor fabs,Malta New York,U.S.-Japan initiative,300mm semiconductor fab,silicon photonics,advanced packaging https://www.eeherald.com/section/news/p1792029100271nwn2onsemiandsun EE Herald en 2026-10-15T01:53:08.000Z onsemi and Sungrow Integrate EliteSiC Hybrid Technology in PowerTitan 3.0 Energy Storage Platform onsemi, Sungrow, EliteSiC hybrid power module, PowerTitan 3.0, utility-scale battery energy storage systems, SiC hybrid module https://www.eeherald.com/section/news/p1791964710739nwn2marvellmicro EE Herald en 2026-10-14T07:58:57.000Z Marvell, Microsoft and Oracle Form OCP Group to Standardize Data Center Hardware Security Marvell Technology Inc,integrated HSM,NIST FIPS 140-3 Level 3,Open Compute Project,cloud and hyperscale data center infrastructure,secure key caching https://www.eeherald.com/section/new-products/p1791964544130nwn2littelfusela EE Herald en 2026-10-14T07:56:35.000Z Littelfuse Launches TP7.0SMD-XC Automotive TVS Diodes With 24 V Clamping Littelfuse, TP7.0SMD-XC Series, TP7.0SMD24CA-XC, automotive TVS diodes, foldback technology, 7000 W peak pulse power, 12 V battery systems, 48 V battery protection https://www.eeherald.com/section/news/p1791963741207nwn2omdiafindsso EE Herald en 2026-10-14T07:54:21.000Z Omdia Finds Sovereign AI Claims Often Lack Proof, Risking Enterprises Omdia, sovereign AI, Sovereign AI: A Playbook for Success, 35 sovereign AI providers, data in transit, network sovereignty safeguards https://www.eeherald.com/section/news/p1791964152006nwn2trendforcepr EE Herald en 2026-10-14T07:49:58.000Z TrendForce Projects 2027 CSP CapEx Above $1.5 Trillion and AI Server Revenue Growth Over 90% TrendForce, CSP CapEx, AI server shipments, AI server revenue, NVIDIA's GB300, AMD's Helios series https://www.eeherald.com/section/news/p1791962937525nwn2qualcommsays EE Herald en 2026-10-14T07:29:37.000Z Qualcomm Says Jury Found Arm Breached Its Architectural License Agreement Qualcomm, Arm, Architectural License Agreement, Oryon CPUs, semiconductor products https://www.eeherald.com/section/news/p1791914492715nwn2infineonxdp8 EE Herald en 2026-10-14T06:12:32.000Z Infineon XDP8HD40S-1 high-voltage hot-swap controller extends grid-to-core 800 VDC AI servers Data Center https://www.eeherald.com/section/news/p1791910950374nwn2jeollaunches EE Herald en 2026-10-14T06:12:30.000Z JEOL Launches HAXIS Low-Angle Ion Milling SEM for Semiconductor Failure Analysis Passive https://www.eeherald.com/section/news/p1791913070791nwn2dwaveunivers EE Herald en 2026-10-14T06:12:27.000Z D-Wave, University of Arkansas Establish Quantum Supply Chain Initiative at Sam M. Walton College of Business Software https://www.eeherald.com/section/news/p1791958302375nwn2semiprojects EE Herald en 2026-10-14T06:12:17.000Z SEMI Projects Global 300mm Fab Equipment Spending to Reach $227 Billion in 2029 SEMI, 300mm Fab Outlook, 300mm front-end fab equipment spending, 300mm fabs, Global Fab Construction Pipeline, AI, high-performance computing https://www.eeherald.com/section/new-products/p1791957514996nwn2gujaratbased EE Herald en 2026-10-14T05:58:00.000Z Gujarat-Based Brilliant Labgrown Grows CVD Diamonds for Wafers, Heat Spreaders and IR Optics https://www.eeherald.com/section/news/p1791904778959nwn2einfochipsco EE Herald en 2026-10-13T15:19:00.000Z eInfochips Completes End-to-End Turnkey ASIC Design with Test Chip Bring-Up