Infineon secures SiC wafer supply from II-VI
To support the increasing demand of siliconcarbide (SiC) power semiconductors from its customers, the leading discrete semiconductor manufacture Infineon has signed a multi-year supply agreement with U.S.-based SiC wafer supplier II-VI Incorporated. Infineon is offering its SiC devices under a brand name called CoolSiC. II-VI has already delivered its first shipment to Infineon. II-VI also to supply 200mm SiC diameter wafers, when Infineon starts using them.
SiC Devices are becoming inevitable in the automotive traction power module and high-power inverter and converters used in solar PV and industrial power systems, due to their huge advantage over silicon MOSFETs.
“SiC compound semiconductors set new standards in power density and efficiency. We are leveraging them to deliver on our strategy of decarbonization and digitalization,” said Angelique van der Burg, Chief Procurement Officer at Infineon. “Infineon is increasing investments in its SiC manufacturing capacity to meet the rapidly growing demand from our customers. We are pleased to add II-VI to our strategic supplier base and grow our business together.”
“Infineon, as a market leader in power semiconductors, is an important partner for us,” said Sohail Khan, Executive Vice President, New Ventures & Wide-Bandgap Electronics Technologies at II-VI. “Our highly specialized products are now helping Infineon provide innovative electronic components to key customers worldwide.”
Infineon says it expects its SiC semiconductor sales to grow by more than 60 percent on average per year, reaching approximately $1 billion by mid-decade. Infineon says the growth momentum to continue for the next off of the decade, so it also to invest in its recently announced additional manufacturing block in Kulim, Malaysia.
Author: Srinivasa Reddy N