Semiconductor packaging and testing company Advanced Semiconductor Engineering is showcasing System in Package (SiP) solutions in consumer applications at Computex 2015, in Taipei, Taiwan, over June 2-6, 2015.
The more than Moore SiP technology is targeted for consumer technologies where RF, processor, memory, sensors, power management, multimedia chips are packed within very tight space.
Advanced SiP requires lesser number manufacturing steps where ICs can be designed and directly embedded onto a substrate, then onto a module.
To better serve the fast-growing IoT segment, ASE said it has evolved its business model by combining its technologies in wire bonding, wafer level, fan-out, flip chip, 2.5D/3D, substrates and embedded IC packaging with USI’s module level assembly. ASE collaborating with Inotera Memories Inc on foundry service for 2.5D silicon interposer and TDK Corporation for proprietary embedded substrate manufacturing.