ID semiconductor specialist NXP Semiconductors and Stora Enso are jointly developing intelligent packaging solution based on NFC RFID. The idea is to track the product from factory to customer, whether manufacturer can ensure brand protection as well as get any evidence related to tampering of the product.
For the consumers this technology provides authenticity of the product, and also information of the product on their mobile phones to the NFC-based communication of the product to the smart phone featuring NFC.
“The co-operation with NXP offers substantial business opportunities for Stora Enso. We have already worked on several concept cases with customers and partners within intelligent packaging. The co-operation with NXP will enable us to bring this development closer to market and provide faster scalability in intelligent paper and board solutions,” says Karl-Henrik Sundström, CEO, Stora Enso.
Stora Enso offers renewable packaging in the area of biomaterials, wood and paper on global markets.