Electronics Engineering Herald                 
Home | News | New Products | India Specific | Design Guide | Sourcing database | Student Section | About us | Contact us | What's New

News

  Date: 29/03/2015

IESA signs MoU with TEEMA

India Electronics and Semiconductor Association (IESA) signed a Memorandum of Understanding (MoU) with Taiwan Electrical and Electronic Manufacturers’ Association (TEEMA) to promote ESDM industry co-operation and investment promotion to benefit both Indian and Taiwanese companies.

IESA said it will encourage Taiwan-based electronics companies to bring more investments and commitments to the ICT ecosystem in the country and also, partner with Indian companies around technology and knowledge transfer.

IESA had also signed a MoU with Taiwan Computer Association (TCA) in Sept 2014.

To update you another related news: SME Chapter of MAIT has signed a Memorandum of Understanding (MoU) with Busan IT Industry Promotion Agency (BIIPA) last week in Bengaluru. MOU aims to bring together Indian and Korean SMEs to promote local manufacturing by regular exchange of information on technology know-how, software development, talent exchange with a strong focus on Industrial development in both the countries. The MoU was signed by Mr. Rahul Gupta, Chairman, SME Chapter of MAIT and by Mr Seo Tae Geon, CEO of Busan IT Industry Promotion Agency in the presence of SMEs from MAIT and Korea.
Author: Srinivasa Reddy N
Header ad Author: Srinivasa Reddy N
Header ad

 
          
ADVT
Home | News | New Products | India Specific | Design Guide | Sourcing database | Student Section | About us | Contact us | What's New
©2012 Electronics Engineering Herald