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Date: 24-01-15

ST’s smart power IC chip fab can be used by universities and research labs

STMicroelectronics and CMP (Circuits Multi Projets) have made ST’s BCD8sP technology platform for smart-power ICs available for prototyping to universities, research labs, and design companies through the silicon brokerage services provided by CMP.

“We expect CMP to help us identify and support innovative projects, and hopefully establish long-term connections with talented designers and research organizations,” said Claudio Diazzi, Sense & Power and Automotive Sector, Front End Manufacturing and Technology R&D, VP-Smart Power Technologies in STMicroelectronics.

The most advanced of ST’s Bipolar-CMOS-DMOS (BCD) technologies in production, the BCD8sP process enables the integration of analog and logic circuitry with high-voltage power components to produce single-chip devices for complex power-conversion and control applications.

This process helped ST to have competitive advantage in delivering smart-power Ics for Hard Disk Drive (HDD) controllers, motor controllers, and power-management ICs for equipment such as smartphones, tablets, and computer servers.

CMP’s clients also have access to 28nm FD-SOI and 130nm SOI (Silicon-On-Insulator), as well as 130nm SiGe processes from STMicroelectronics.

“With ST’s world-class BCD process in our portfolio, we can now provide even stronger support for advanced smart-power design projects,” said Jean-Christophe Crebier, Director of CMP. “Many top universities worldwide have already taken advantage of the collaboration between CMP and ST. About 300 projects have been designed in ST’s 90nm process, more than 350 in bulk 65nm, and already over 50 projects prototyped in 28nm FD-SOI.”

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