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Date: 15-10-14

TI lists its copper wire-bonding achievements

Texas Instruments said it has pioneered the development of copper wire bonding for semiconductor packaging and a shared the below data on its achievements in copper wire bonding:

All new TI technologies and packages are being developed with copper wire bond.
TI is currently shipping about two billion units of copper wire bond technology each quarter. This includes production for key automotive segments.
TI began shipping copper wire in its products in 2008.
At present all of TI's assembly and test (A/T) sites are running copper wire bonding on all TI package types, including BGA, QFN, QFP, TSSOP, SOIC, PDIP and others. Copper is at 71 percent of TI's total wire usage and TI is in production with:
Minimum 30/60 microns staggered bond pad pitch
Up to 1000 wires in BGA packages
Multi-chip stacked die with die to die wire bonding
Minimum 0.8mil copper wire diameter

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