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Date: 20-09-14

Spansion and Winbond sign patent sharing agreement

Spansion signed cross-license agreement with Winbond Electronics Corporation to give both companies access to each other's Flash memory patent portfolio.

"This agreement reflects the strong IP position of both companies and our ongoing commitment to provide and have access to valuable memory patents in the industry," said Ali Pourkeramati, senior vice president of strategic alliances at Spansion. "We believe the cooperation between Spansion and Winbond will be positive for our customers, enabling them to benefit from innovation and new technologies."

"The agreement opens up opportunities for both companies to leverage each other's strengths to broaden the product portfolio and collaborate on new products," said John Park, Vice President of Flash Memory Business Group at Winbond.

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