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Date: 24-07-14

TEL and IME to research on room temperature bonding of semiconductor wafers

Tokyo Electron Limited (TEL) and the Institute of Microelectronics in Singapore (IME) reached an agreement to establish, and begin joint research in semiconductor packaging such as 2.5D and 3D wafer level packaging.

The Joint research to work on room-temperature wafer bonding (and debonding) by means of a temporary bonding glue, permanent wafer bonding, batch bonding of fine pitch chip-on-wafer, and also Insitu aligning metal bonding. These technologies are useful in 2.5D and 3D semiconductor devices.

The joint solution is aimed at reducing cost in mass production of 3D chips.

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