SEMI has forecasted the semiconductor fab equipment spending (new, used, for Front End facilities in 2014 is expected to increase 24 percent in 2014 (US$35.7 billion) and about 11 percent (US$39.5 billion). SEMI also forecast for the year 2015 where it says the semiconductor fab equipment spending may reach or even surpass historic record year 2011 (about US$39.8 billion).
SEMI finds in 2014 the three largest regions for fab equipment spending will be Taiwan with over US$10.3 billion, the Americas with over US$6.8 billion, and Korea with over US$6.3 billion, and in 2015, these same regions will lead in spending: Taiwan will spend over US$11 billion, Korea over US$8 billion, and the Americas almost US$7 billion. Europe/Mideast region will show the strongest rate of growth, about 79 percent compared to the previous year and the same region will continue to grow fast in 2015, with an increase of about 20 percent, according to SEMI.
SEMI suggests there won't be much change in the installed capacity over next four years.
Because of the increased complexity of leading-edge nodes, such as more process steps and multiple patterning, fabs experience a decline in capacity as the same fab space produces less, says SEMI.
Worldwide installed capacity grew by less than 2 percent in 2013 and is expected to grow just 2.5 percent in 2014 and 3 percent in 2015, as per the study by SEMI.
Foundry capacity to grow at 8-10 percent yearly, and Flash is up 3 to 4 percent for 2014, DRAM equipment spending is expected to grow by 40 percent in 2014 with installed capacity for DRAM is expected to stay flat or even drop 2 percent, reports SEMI.