Invensas and STS Semiconductor & Telecommunications Co. Ltd. have entered into an agreement to validate high volume manufacturing capability for Invensas' Bond Via Array (BVA) tech, a Package-on-Package (PoP) technology for System on Chip (SOC) and memory integration in mobile devices. Called as a "Bridge Technology to 3DIC", BVA utilizes established wire-bond assembly techniques to enable low power and high-bandwidth (1000 IO+) packaging in an ultra-small form factor, targeting mobile devices. "We are delighted to partner with Invensas on BVA," stated Chang-Bum Shim, Chief Operating Officer and Executive Vice President for STS. "STS understands the critical need to increase interconnect bandwidth for the growing Package-on-Package mobile SOC market, without increasing product size or the cost to the end user. Our engineering and manufacturing capabilities are ideally suited to the commercialization of BVA." "STS is an ideal partner for BVA," said Simon McElrea, CTO of Tessera Technologies, Inc. and President of Invensas. "Their continual investment in cutting-edge packaging technology and associated manufacturing capability, coupled with their growth model in mobile and communication devices, is perfectly aligned for BVA commercialization."