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Date: 03-12-13

Coventor hosts a roundtable on FinFET, 3-D IC fabrication and more

Virtual semiconductor fabrication software vendor Coventor is hosting an expert roundtable discussion at the 2013 edition of IEEE International Electron Devices Meeting (IEDM) going to be held on December 7-11, 2013 in Washington, DC U.S. The topics to be discussed includes FinFET, 3-D ICs, multiple patterning, advance modeling and simulation techniques, process variation challenges, and accelerating yield ramps.

Participants in the roundtable will include:

Dr. Brian Green, Senor Engineer/FEOL Architect: IBM
Mark Fisher, Senior Research Engineer: Micron
Dr. Andy Wei, Principle Member of Technical Staff – 10nm: GLOBALFOUNDRIES
Jaouen Herve, Director, Modeling & Simulation: ST Microelectronics
Sean Lian, Director/Technology Lead: Samsung
Laith Altimime, Director CMOS Technology & Design: IMEC
David Fried, CTO-Semiconductor: Coventor, Inc.

Event details:

Tuesday, December 10
Churchill Embassy Row Hotel: Kalorama Ballroom

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