Virtual semiconductor fabrication software vendor Coventor is hosting an expert roundtable discussion at the 2013 edition of IEEE International Electron Devices Meeting (IEDM) going to be held on December 7-11, 2013 in Washington, DC U.S. The topics to be discussed includes FinFET, 3-D ICs, multiple patterning, advance modeling and simulation techniques, process variation challenges, and accelerating yield ramps.
Participants in the roundtable will include:
Dr. Brian Green, Senor Engineer/FEOL Architect: IBM
Mark Fisher, Senior Research Engineer: Micron
Dr. Andy Wei, Principle Member of Technical Staff – 10nm: GLOBALFOUNDRIES
Jaouen Herve, Director, Modeling & Simulation: ST Microelectronics
Sean Lian, Director/Technology Lead: Samsung
Laith Altimime, Director CMOS Technology & Design: IMEC
David Fried, CTO-Semiconductor: Coventor, Inc.
Tuesday, December 10
Churchill Embassy Row Hotel: Kalorama Ballroom