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Date: 03-12-13

Applied is hosting a forum on building 3-D NAND flash memory devices

Semiconductor equipment manufacturer Applied Materials is hosting a forum on December 10, 2013 in Washington D.C. to discuss technology and market challenges in 3D NAND flash memory fabrication.

Applied Materials and guest panelists from several industry leaders to provide insight on technical issues in 3D NAND memory manufacturing such as scaling, applications, cost per bit, and the technologies to follow.

The panel is titled as "3D NAND Is a Reality - What's Next?"
To register for this event visit: http://www.appliedmaterials.com/NAND-panel.

Moderator: Gill Lee, senior director, principal member of technical staff, Silicon Systems Group, Applied Materials

Panel:
Ritu Shrivastava, Ph.D. - vice president, technology development, SanDisk Corporation
Chuck Dennison - senior director, process integration, Micron Technology, Inc.
Seok-Kiu Lee - vice president, head of flash device technology group, R&D division, SK hynix Inc.
Hang-Ting Lue, Ph.D. - deputy director, Nanotechnology R&D division, Macronix International Co., Ltd.
Bradley Howard, Ph.D. - vice president, advanced technology group, Etch, Applied Materials, Inc.

Where: Omni Shoreham Hotel,2500 Calvert Street NW, Washington, D.C.

When: Tuesday, December 10, 2013

Schedule:
5:00 - 6:00pm Shuttle from Hilton Washington Hotel
5:00 - 6:15pm Registration and Reception
6:15 - 7:30pm Panel Discussion
7:30pm Return shuttle to Hilton Washington Hotel

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