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  Date: 07/11/2013

450mm and 3D IC programs at SEMICON Japan

SEMI has announced the keynote speakers for SEMICON Japan 2013, which includes Ryoji Chubachi, AIST; Ajit Manocha, GLOBALFOUNDRIES; and Paul Boudre, Soitec.

Ryoji Chubachi, president at National Institute of Advanced Industrial Science and Technologies, believes that the total strength of entire semiconductor supply chain from materials and equipment to device still exists in Japan and facilitating open innovations will lead Japan to resume the position in the global semiconductor industry. Ajit Manocha, CEO at GLOBALFOUNDRIES, will examine the evolution and future of the foundry model, the technical and business drivers reshaping the landscape, and how fabless and IDM companies must change their perspective on what has worked in the past, regardless of how you define “leading edge.” Paul Boudre, CEO at Soitec, will illustrate how engineered substrates technologies can bring innovation by pushing “Moore’s law” and “More than Moore” further in the mobile era where the electronic industry is driven by the “always connected” trend and insatiable user demand. The opening ceremony and opening keynotes are no charge for SEMICON Japan 2013 exposition attendees, but pre-registration is required.

Special programs at SEMICON Japan include: on December 5, a 450mm Transition Update Forum with speakers from G450C, imec, Nikon, and Tokyo Electron; on December 4, an EHS Standards Workshop “Challenges for 450mm” and a 450 Manufacturing EHS and Facilities Seminar; and on December 6, “Notchless System: 450 Standard Considered.” In addition, on December 5-6, numerous programs on 3D-IC include: 3D-IC Summit “Key to a Quantum Leap,” OSAT Executive Forum, TA&P Night plus three programs on TechSTAGEs.

SEMICON Japan 2013 to take place at Makuhari Messe in Chiba on December 4-6. Registration is open for both the exhibition and programs on the SEMICON Japan 2013 website at www.semiconjapan.org.

SEMI stated in its release "Restructuring and consolidation has led to a new focus for the semiconductor manufacturers in Japan. As a result, the semiconductor equipment market in Japan will experience growth in and 2014, driven by higher spending for memory production and in spending increases planned for the manufacturing of power semiconductors and “More than Moore” semiconductor technologies. Total equipment spending in Japan is estimated to reach $4.0 billion by 2014. Combining this with the $8 billion spending on semiconductor materials, Japan represents about a $12 billion market in 2014 for the suppliers of equipment and materials."

SEMI has forecasted the semiconductor manufacturing equipment spending for Flash Alliance could approach between $1.8 billion to $2.3 billion this calendar year and even more in 2014 because of the overall strong market demand for NAND flash in mobile products. Toshiba announced plans to spend up to $300 million (30B yen) to construct the Fab 5 phase 2 at the Yokkaichi plant location. This new fab will ramp for production of sub-20 nm/3D flash memories, with building construction completed by about mid 2014.

Japanese semiconductor companies are also aiming to grow their share in the power semiconductor device market, according to SEMI. Fuji Electric, Toshiba, Mitsubishi Electric, Panasonic, and Hitachi are going to invest in semiconductor manufacturing. New investments for this year and next point to a rebound in equipment spending in Japan, as per SEMI.

The product exhibitions at the event will have separate pavilions for this below semiconductor manufacturing equipment domains:
Advanced Electronics Technology
Chemical Materials Management
Micro Fabrication & Fine Process Technology
Advanced Manufacturing Technology
Supply Chain
Secondary Equipment and Service

Japanese-English simultaneous translation will be available for many of the events and sessions at SEMICON Japan.
Author: Srinivasa Reddy N
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