STATS ChipPAC has announced reaching of 1000th patent milestone granted by the U.S. Patent and Trademark Office (USPTO).
STATS ChipPAC said since the inception of its Intellectual Property (IP) program in 2000, STATS ChipPAC has filed more than 1,500 patents and published patent applications with the USPTO and more than 900 patents and applications in other countries, of which more than 200 have been registered or allowed as patents in Singapore, South Korea, Taiwan and other countries. This is at least 400 more U.S. patents and applications than other companies in the global Outsourced Semiconductor Assembly and Test (OSAT) industry, claims STATS ChipPAC. STATS ChipPAC filed patents in the areas of wafer level packaging, Post Wafer fab Processing (PWfP) or mid-end processing, Through Silicon Via (TSV), flip chip interconnect, integrated passive devices (IPD) and 2.5D/3D package integration. STATS ChipPAC claims it has built up a patent portfolio in which advanced or future technologies comprise 60% of its IP.
IEEE ranked STATS ChipPAC among the top 10 semiconductor manufacturing companies in the world for the last two consecutive years based on the strength of its IP and technology innovations.
“Our 1,000th U.S. patent is a milestone achievement for STATS ChipPAC. Over the last 5 to 10 years, we have demonstrated our commitment to technology innovation and built a high-quality, innovative IP portfolio. In 2011, we became the leading patent holder among our competitors worldwide in terms of the number of U.S. patents granted and have continued to develop advanced technology and process improvements that will drive evolutionary packaging for our customers,” said Dr. Han Byung Joon, Executive Vice President and Chief Technology Officer, STATS ChipPAC.