IC Insights has come out with its latest report on consumption of silicon wafers for different technology nodes. IC Insights finds more than one quarter of installed wafer capacity worldwide is dedicated to producing IC devices using process geometries (or feature sizes) smaller than 40nm.
Below is the details of latest analysis released by IC Insights:
Installed capacity is divided into six categories based on the minimum geometry of the processes used in wafer fabrication. The six categories range from 0.4µ category maintains a fairly large share of total capacity, even though it has been longer than a decade-and-a-half since 0.5µ process technology was considered leading-edge. The main reason is that huge quantities of commodity type devices such as standard analog and general-purpose logic are manufactured with well-established process technologies having larger then 0.4µ feature sizes. In addition, high-voltage IC products require large-geometry process technologies.
Figure 2 shows the leading suppliers of installed wafer capacity based on minimum geometry. It is not surprising that Samsung, Intel, Toshiba/SanDisk, SK Hynix, and Micron top the list with the greatest amount of leading-edge capacity. The biggest capacity holders in the large-feature process category (>0.2µ) consist of several analog and mixed-signal chip suppliers.