Freescale Semiconductor has announced that it has shipped 175+ million high-power, high-frequency RF power transistors in plastic packages. RF Designers choose plastic package over ceramic for the cost advantage. Freescale is offering low cost plastic packaged device while maintaining performance. “Freescale not only pioneered the development of high-power RF packaging to meet the demanding requirements of power amplifier manufacturers, but we continue to set the pace in plastic package performance, temperature ratings, reliability and volume production,” said Ritu Favre, senior vice president and general manager for Freescale’s RF business. “Shipping more than 175 million RF power devices in plastic packages underscores the broad market acceptance of Freescale's innovative plastic packaging technology.” Freescale has inherited this technology from Motorola, which was earlier known for making high-rel semiconductor devices for broad range of applications. In 2006, Freescale has introduced the first 2 GHz RF power plastic devices with a maximum junction temperature rating of 225 degrees Celsius matching ceramic's performance and later Freescale has also introduced OMNI over-molded plastic packaging withstanding even more harsh weather conditions.