DSP Group has licensed and deployed the CEVA-TeakLite-III DSP in its latest voice and audio SoC. The DBMD2 SoC performs complex real-time signal processing functions like noise reduction, beam-forming, voice activation and virtual surround, in addition to addressing voice activation recognition performance and quality issues in noisy environments, mainly powered by the CEVA-TeakLite-III DSP at the core of the DBMD2 SoC.
"The CEVA-TeakLite-III DSP provides the perfect balance of ultra-low power and exceptional audio/voice processing for our DBMD2 SoC at the heart of the HDClear solution," said Dr. Arie Heiman, Corporate Vice President and General Manager of HDMobile at DSP Group. "The maturity and robustness of the complete CEVA package, from the DSP implementation through to the CEVA Toolbox™ software development environment and hardware development kit helped us in reaching our demanding goals."
Eran Briman, vice president of marketing at CEVA, commented: "We are pleased to see the quick design turnaround time DSP Group has been able to achieve, with the DBMD2 SoC already available in silicon. The capabilities of their latest HDClear product offering are impressive and firmly position DSP Group on the leading edge of the market for advanced, low power audio/voice platforms. By using the programmable CEVA-TeakLite-III DSP as a foundation, DSP Group enables their customers to differentiate their products via software add-ons and updates, allowing them to evolve and adapt to new market requirements."