Toshiba Corporation has announced that Shozo Saito, Corporate Senior Executive Vice President responsible for Toshiba Group's electronic components business, will make the opening keynote speech at 14th IC PACKAGING TECHNOLOGY EXPO, on Thursday, January 17, an event on semiconductor packaging.
Mr. Saito will speak on "Toshiba's Semiconductor and Storage Products Strategy and Expectations of Packaging Technology." He will introduce Toshiba's strategies for total innovation in storage in the coming age of smart communities and the company's expectations of semiconductor packaging technologies necessary for success in its wide ranging semiconductor business.
Keynote speech at IC PACKAGING TECHNOLOGY EXPO
Date: Thursday, January 17
Venue: 4 West Hall, Tokyo Big Sight
Subject: Toshiba's Semiconductor and Storage Products Strategy and Expectations of Packaging Technology
Official site of "IC PACKAGING TECHNOLOGY EXPO": http://www.icp-expo.jp/en/