Date: 03/12/2012

IEEE Fellows from semiconductor domain conferred in 2012

The Fellow grade in IEEE is conferred upon a person with an extraordinary record of accomplishments in any of the IEEE fields of interest. Here we provide list of people from the semiconductor domain both from chip companies as well as institutes who are conferred with Fellow grade effective Jan 2013.

Suman Datta
Penn State University
University Park, PA, USA
for contributions to high-performance advanced silicon and compound semiconductor
transistor technologies


David Esseni
University of Udine
Udine, Italy
for contributions to characterization and modeling of mobility and quasi-ballistic transport in MOS transistors

Gerard Ghibaudo
IMEP-LAHC
Grenoble, France
for contributions to electron device characterization and modeling

Kenneth Goodson
Stanford University
Stanford, CA, USA
for contributions to thermal management of electronic packaging

Jung Han
Yale University
New Haven, CT, USA
for contributions to epitaxial technologies for wide bandgap semiconductor materials
and devices

Kenneth A. Hansen
Freescale Semiconductor, Inc.
Lago Vista, TX, USA
for technical leadership in wireless communications

Michael S. Hsiao
Virginia Tech
Blacksburg, VA, USA
for contributions to automatic test pattern generation of integrated circuits


Takatomo Enoki
Nippon Telegraph and Telephone Corporation, NTT
Atsugi-shi, Kanagawa, Japan
for contributions to compound semiconductor high speed integrated circuits for optical
and wireless communication systems


Kadaba R. Lakshmikumar
Ikanos Communications
Basking Ridge, NJ, USA
for contributions to design of mixed signal CMOS integrated circuits for telecommunications


Wei Hu Koh
Pacrim Technology
Irvine, CA, USA
for development of three-dimensional multichip modules and flip chip interconnects

Kevin Wesley Kobayashi
RF Micro Devices
Torrance, CA, USA
for contributions to monolithic microwave integrated circuits (MMIC)

Gerhard Klimeck
Purdue University
West Lafayette, IN, USA
for contributions to atomistic quantum simulation tools for nanoelectronic devices

Chen-Hua Douglas Yu
Taiwan Semiconductor Manufacturing Company (TSMC)
Hsin-Chu County, Taiwan
for leadership in development of interconnect technology for integrated circuits

Peide Ye
Purdue University
West Lafayette, IN, USA
for contributions to compound semiconductor MOSFET materials and devices

Ingrid M.R. Verbauwhede
University of Leuven
Heverlee, NA, Belgium
for contributions to design of secure integrated circuits and systems

Jerzy Tyszer
Poznan University of Technology
Poznan, Poland
for contributions to digital VLSI circuit testing and test compression


Thomas N. Theis
IBM T.J. Watson Research Center
Yorktown Heights, NY, USA
for leadership in the development of semiconductor technologies


Randhir P.S. Thakur
Applied Materials
Fremont, CA, USA
for leadership in development and implementation of single-wafer technology in
semiconductor manufacturing

Kevin Skadron
University of Virginia
Charlottesville, VA, USA
for contributions to thermal modeling in microprocessors


Subhash L. Shinde
Sandia National Laboratories
Albuquerque, NM, USA
for contributions to thermal management and 3D electronics packaging technologies

John Robertson
Cambridge University
Cambridge, UK
for contributions to the understanding of high-k dielectrics and metal gate electrodes for
CMOS technology


Sanjay Raman
Defense Advanced Research Projects Agency
Arlington, VA, USA
for leadership in adaptive microwave and millimeter-wave integrated circuits



Kameshwar Poolla
University of California, Berkeley
Berkeley, CA, USA
for contributions to system identification, robust control, and applications to
semiconductor manufacturing


John Williams Palmour
Cree, Inc.
Durham, NC, USA
for leadership in the development and commercialization of wide-bandgap semiconductor devices


Subhasish Mitra
Stanford University
Stanford, CA, USA
for contributions to design and test of robust integrated circuits

Gaudenzio Meneghesso
University of Padova
Padova, Italy
for contributions to the reliability physics of compound semiconductors devices


Cian O. Mathuna
Tyndall National Institute
Cork, Ireland
for leadership in the development of power supply using micromagnetics on silicon

Carlos Mazure
SOITEC
Bernin, France
for leadership in the field of silicon on insulator and memory technologies

Radu Marculescu
Carnegie Mellon University
Pittsburgh, PA, USA
for contributions to design and optimization of on-chip communication for embedded multicore systems

Michal Lipson
Cornell University
Ithaca, NY, USA
for contributions to design and applications of nanoscale photonic devices

James P. Libous
Lockheed Martin
Endwell, NY, USA
for contributions to switching noise minimization in CMOS technology

Charles F. Campbell
TriQuint Semiconductor
Richardson, TX, USA

Marco Corsi
Texas Instruments Inc
Parker, TX, USA

IEEE Fellow John L. Hennessy, president of Stanford University, is the recipient of the 2012 IEEE Medal of Honor “for pioneering the RISC processor architecture and for leadership in computer engineering and higher education.”