|
Date:5th June 2012
ST delivers MEMS microphone in plastic
package for consumer e-devices
STMicroelectronics has announced that it is the first company
in the world that mass manufactures MEMS microphones in
plastic packages. The patented technology breakthrough saves
space and increases durability in consumer and professional
voice-input applications, from mobile phones and tablets
to noise-level meters and noise-cancelling headphones.
ST claims that they lead the way with industry-unique,
innovative plastic packages. ST's microphone assembly process
ensures better electrical and acoustic performance, mechanical
robustness, slimmer form factors, and reduction in microphone
chip sizes to 2x2 mm in devices that will soon arrive in
the market.
These microphones are suitable for assembly on flat cable
PCBs that simplify design in space constrained consumer
devices. The patented package technology allows equipment
manufacturers to place the 'sound hole' either on the top
or the bottom of the package to ensure the slimmest possible
design and shortest acoustic path from the environment to
the microphone. While the microphones with the sound hole
on the top (top-port) suit the size and sound-inlet position
requirements of laptops and tablets, the bottom-port microphones
are mostly used in mobile phones.
Microphones in plastic packages had outperformed traditional
metallic-lid devices in durability as per ST's compression
and drop tests. When subjected to a force of 40N1 - equivalent
to placing a 4kg weight on the tiny chip - microphones in
metallic packages collapsed, whereas ST devices in plastic
packages remained intact. Similar results were obtained
when devices from both categories were exposed to 40 drops
from a height of 1.5m with a static force of 15N applied
on the package. The superior robustness holds for both flat-cable
printed-circuit boards (PCB) and traditional rigid PCB designs.
ST's plastic package microphones integrate an internal
shielding cage for electromagnetic immunity and are compatible
with standard surface mount assembly machinery and conventional
pick and place equipment.
More information on ST's MEMS microphones http://www.st.com/internet/analog/subclass/1564.jsp
Author: Srinivasa Reddy N
|
