Fairchild Semiconductor licenses Infineon's advanced automotive MOSFET packaging technology H-PSOF (Heatsink Plastic Small Outline Flat Lead), a JEDEC standard TO-Leadless (TO-LL) package (MO-299).
High-current automotive applications, including battery management for hybrid vehicles, Electric Power Steering (EPS), active alternators and other heavy load electrical systems uses this type of package.
Advantages of TO-Leadless package
· 1st package to enable current capabilities of 300A
· Board space benefits compared to the current D2PAK package (>20% smaller; 50% lower package height)
The latest MOSFET technologies from Fairchild will be deployed by the TO-Leadless power package technology and first samples are expected in 2nd half of 2012 while the production quantities are made available in mid 2013.
Marion Limmer, vice president of Fairchild's Automotive Business Unit, said "Building on a long history serving the automotive industry, Fairchild Semiconductor is leading the way in addressing the power semiconductor needs of today's automobile manufacturers. By deploying this TO-Leadless power package technology, Fairchild is helping designers leverage the latest low resistance MOSFET technologies, further expanding our presence in the automotive market".
Jochen Hanebeck, president of the Automotive Division at Infineon Technologies AG, quoted, "With this agreement, the automotive industry benefits from a reliable second-source supplier base for a high-current power device that provides many benefits in terms of space, efficiency and performance. As a technology leader in automotive power applications, Infineon exploits its technical know-how to provide automotive system suppliers with MOSFETs enabling higher efficiency and performance while also minimizing the risk associated with single supplier sourcing".
Further information on the JEDEC standard of the H-PSOF TO-Leadless package can be found at http://www.jedec.org. search for MO-299A.pdf