Date:12th Jan 2012
IBM and GLOBALFOUNDRIES's partnership
chip factory in U.S. starts 32nm production
GLOBALFOUNDRIES and IBM newest semiconductor factory called
"Fab 8" in Saratoga County, New York State has
started maiden production run of microprocessors based on
IBM's latest 32nm silicon-on-insulator chip technology.
"Today's announcement is a natural extension of our
longstanding partnership with IBM that includes production
of 65nm and 45nm chips at our fabs in Singapore and Germany,"
said GLOBALFOUNDRIES CEO Ajit Manocha. "With the addition
of our newest factory in New York, we will now be jointly
producing chips with IBM at four fabs on three continents."
New York's "homegrown" HKMG technology offers
cost-savings, better performance
GLOBALFOUNDRIES says its new Fab 8 campus, located in the
Luther Forest Technology Campus about 100 miles north of
the IBM campus in East Fishkill, stands as one of the most
technologically advanced wafer fabs in the world and the
largest leading-edge semiconductor foundry in the United
States. When fully ramped, the total clean-room space will
be app`s per month. Fab 8 to make both 32/28nm nodes chips
and also designed for even lower nodes.
As per the release this fab will also "Gate First"
approach to High-k Metal Gate (HKMG) that has reached volume
production in GLOBALFOUNDRIES' Fab 1 in Dresden, Germany.
This approach to HKMG offers higher performance with a 10-20%
cost saving over HKMG solutions offered by other foundries,
while still providing the full entitlement of scaling from
the 45/40nm node, claims, GLOBALFOUNDRIES.
The new chips made from this fab also said to feature IBM's
eDRAM (embedded dynamic random access memory) technology,
which are claimed by IBM to improve on-processor memory
performance in about one-third the space with one-fifth
the standby power of conventional SRAM (static random access