Date: 16th Jun 2011

USB SuperSpeed 3.0 integrated devices shipments to reach 80 Million in 2011

In interfacing external devices to mobile computing devices the speed matters, so is the growth of devices integrated with USB3.0, which offers the data transfer rates at the speeds of 5 Gbps.
Market researcher In-Stat has forecasted nearly 80 million USB SuperSpeed-enabled devices will ship in 2011. AMD has integrated SuperSpeed into the core logic chipset. Intel is expected to follow with its Ivy Bridge chipset in 2012.

Other details from the report include:
More than 3.5 billion USB devices shipped in 2010.
High-speed USB is still the most popular USB interface, comprising over three-quarters of USB device shipments in 2010.
Core logic integration is key to the acceptance of a new USB specification, because it allows notoriously cost-conscious PC OEMs to offer it for free.
CE continues to be a key product segment for USB, with digital still cameras, digital televisions (DTV), set top boxes, and portable media players (PMP) among the most popular applications.

"Mobile phones are a key driver for USB overall, and will play a role in the adoption of SuperSpeed USB," says Brian O'Rourke, Research Director. "In 2010, USB was found internally in over 1.2 billion mobile phones, with high-speed USB dominating. In addition, the number of USB ports in phones increased to over 100 million units. The first SuperSpeed USB phones won't hit the market until late 2013, but they will be accompanied by a new SuperSpeed connector for phones that will succeed the current micro-USB port found in today's phones."

To learn more on In-Stat's report visit www.instat.com

If you are VLSI designer and would like to learn benefits of putting USB3.0 in your next chip read the white paper titled "SuperSpeed Your SoCs with USB 3.0 IP" from Synopsys at url http://www.synopsys.com/dw/doc.php/wp/dw_usb3_wp.pdf.

The IP for USB3.0 is available from Synopsys and also from Arasan (www.arasan.com).