Date: 21st Apr 2011

Rudolph launches new wafer inspection module

Rudolph Technologies, Inc. has announced the global launch of the F30 Advanced Macro Inspection Module for testing semiconductor wafers. Rudolph said multiple F30 Inspection Modules have been purchased in recent weeks, and several are already installed in high-volume semiconductor manufacturing facilities. Rudolph did not disclose the names of the buyers but they include two European fabs, a leading Asian foundry, a leading MEMS producer, and a process equipment manufacturer that is developing an integrated inspection solution. Each customer had their own specific needs, but all chose the F30 Module for its flexible blend of throughput and detection sensitivity, resulting in a lower CoO, states Rudolph.

"Foundries and IDMs are choosing the F30 Module for several reasons, including its improved throughput over the entire sensitivity range when compared to previous generation tools," said Scott Balak, Rudolph's director of front-end inspection products. "In addition, the hardware platform is capable of supporting 450mm development, and is designed to accommodate future customer requirements and new capabilities."

"We are pleased with the market demand for this new product and the variety of inspection processes our customers have chosen to implement using the F30," Balak continued. "The F30 Module combines automated setup, intelligent software and robust capability-all staged on a flexible platform designed to accommodate additional capability as defined by our customers' changing requirements."