Date: 13th Aug 2010
MoSys, Radiocomp and GDA partnering to
serve 3GPP LTE and 4G semiconductor market
MoSys, Radiocomp and GDA Technologies are partnering to
deliver solution for semiconductor chip makers in the area
of 3GPP long term evolution (LTE) and 4G cellular base station
component market. MoSys is partnering with Radiocomp to
provide a complete Common Public Radio Interface (CPRI)
and Open Base Station Architecture Initiative (OBSAI) solution
and with GDA to provide a Serial Rapid I/O (SRIO) base-band
solution. The combination of CPRI, OBSAI and SRIO is to
provide complete end to end wireless SerDes connectivity
solution. The new joint solution is compliant with version
4.1 of the CPRI specification and version RP3 v4.1 of the
OBSAI specification. The targeted market here is semiconductor
device and component manufacturers.
"The proliferation of 3G and 4G enabled wireless devices
is creating exponential growth and demand for greater bandwidth
and higher data rates," said David DeMaria, vice president
of Business Operations at MoSys. "By teaming up with
Radiocomp and GDA, our joint IP solution will help component
designers implement a highly configurable solution that
supports today's mobile and wireless standards, and ultimately
improves wireless users' experience by providing faster
downloads of data and video."
"We are experiencing a sharp rise in the demand for
easy-to-use, off-the-shelf, and plug & play CPRI and
OBSAI IP core solutions capable of boosting the bandwidths
and data rates of mobile base stations. Our experience in
developing and deploying CPRI & OBSAI-enabled LTE Remote
Radio Heads shows that our IP solutions are fully functional
and ready for use. The joint solution will help customers
minimize design efforts, and greatly accelerate their time
to market," said Christian Lanzani, Senior Product
Manager at Radiocomp.
Mr. Isaac Sundarajan, CEO of GDA Technologies Inc., a fully
owned subsidiary of L&T Infotech, and Executive Vice
President of Product Engineering Services at L&T Infotech,
stated, "As industry leaders in our respective technologies,
we are offering customers silicon proven SIP in Serial RapidIO
versions 1.3 and 2.1 uniquely with AXI to Serial RapidIO
with DMA & DME bridging functions for the best solutions
available on the market specifically for the growing Wireless
Base Station SoCs. We are uniquely positioned because we
are able to reduce integration cost and risk, while shortening
time-to-market."
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