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   Date: 13th Aug 2010

MoSys, Radiocomp and GDA partnering to serve 3GPP LTE and 4G semiconductor market

MoSys, Radiocomp and GDA Technologies are partnering to deliver solution for semiconductor chip makers in the area of 3GPP long term evolution (LTE) and 4G cellular base station component market. MoSys is partnering with Radiocomp to provide a complete Common Public Radio Interface (CPRI) and Open Base Station Architecture Initiative (OBSAI) solution and with GDA to provide a Serial Rapid I/O (SRIO) base-band solution. The combination of CPRI, OBSAI and SRIO is to provide complete end to end wireless SerDes connectivity solution. The new joint solution is compliant with version 4.1 of the CPRI specification and version RP3 v4.1 of the OBSAI specification. The targeted market here is semiconductor device and component manufacturers.

"The proliferation of 3G and 4G enabled wireless devices is creating exponential growth and demand for greater bandwidth and higher data rates," said David DeMaria, vice president of Business Operations at MoSys. "By teaming up with Radiocomp and GDA, our joint IP solution will help component designers implement a highly configurable solution that supports today's mobile and wireless standards, and ultimately improves wireless users' experience by providing faster downloads of data and video."

"We are experiencing a sharp rise in the demand for easy-to-use, off-the-shelf, and plug & play CPRI and OBSAI IP core solutions capable of boosting the bandwidths and data rates of mobile base stations. Our experience in developing and deploying CPRI & OBSAI-enabled LTE Remote Radio Heads shows that our IP solutions are fully functional and ready for use. The joint solution will help customers minimize design efforts, and greatly accelerate their time to market," said Christian Lanzani, Senior Product Manager at Radiocomp.

Mr. Isaac Sundarajan, CEO of GDA Technologies Inc., a fully owned subsidiary of L&T Infotech, and Executive Vice President of Product Engineering Services at L&T Infotech, stated, "As industry leaders in our respective technologies, we are offering customers silicon proven SIP in Serial RapidIO versions 1.3 and 2.1 uniquely with AXI to Serial RapidIO with DMA & DME bridging functions for the best solutions available on the market specifically for the growing Wireless Base Station SoCs. We are uniquely positioned because we are able to reduce integration cost and risk, while shortening time-to-market."

          
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