Wipro lauds Mentor's PCB design and VLSI verification tools for saving time

Wipro does significant VLSI and electronic design services for some of the best semiconductor and electronics product companies in the world. One of the leading electronics design automations software vendor Mentor Graphics has received 'well done' pat from Wipro for supplying chip design and PCB design tools which has reduced design cycles of Wipro's customers' products by over 40%.

In the board and PCB design space the tools praised by Wipro are Board Station, Expedition and XtremePCB. In IC implementation area, Wipro is using Mentor Graphics's TestKompress Xpress which is providing test pattern compression greater than 100X without sacrificing test coverage. Wipro also acknowledged Mentor's Questa verification platform is effectively used in the SystemVerilog and complex SoC verification space.

"Advances in the electronics industry are causing PCBs to become increasingly complex and challenging to design," said Prasad Bhatt, Vice President of Semiconductor and System Solutions, Wipro Technologies.

"With Mentor Graphics' PCB design solutions like Board Station, Expedition and XtremePCB, we were able to reduce design cycles by over 40% and also address key challenges to meet market demands, facilitate global collaboration, accelerate time-to-market, increase margins, and improve PCB reliability."

With much of the digital interconnects made inside the semiconductor chips and the external interface going serial and wireless way, the complexity of PCBs in high volume products bound to reduce in the coming years. This trend will drive EDA industry to develop software to provide robust on-chip interconnects and keep the space outside the chip with less PCB tracks. One more trend in this direction is software to design 3-dimensional multi-chip or multi-component packages, leading to semiconductor cube rather than a semiconductor chip. It will be easier for companies like Mentor and Cadence with expertise in both PCB and chip design, to develop design software for 3-dimensional multi-chip packages.