Infineon and Fairchild Semiconductor to make their MOSFETs package-compatible

Infineon and Fairchild Semiconductor have agreed to make their power MOSFETs in compatible packages. The Infineon's PowerStage 3x3 or Fairchild MLP 3x3 (Power33) packages are designed to be physically (pin-to-pin and footprint) compatible with each other.

This ensures the buyer with alternate supplier with similar packaging when one of the suppliers ends the supply of MOSFETs and also gives the designer the choice to choose the vendor. These MOSFETs with packaging compatibility from Infineon and Fairchild Semiconductor are used in DC-DC converter applications in the current range from 3A to 20A.

"Standardizing power packages benefits our customers as we minimize the amount of 'unique' packages available in the market place, while offering solutions that enhance performance levels in smaller form factors than the previous generations," said Richard Kuncic, director and product line manager Low Voltage MOSFETs at Infineon Technologies.

"Fairchild and Infineon have standardized the pin-out and have complementing performance levels, offering customers two sources for their high efficiency design needs in the computing, telecom and server markets," said John Bendel, Fairchild's senior vice president of Low Voltage Products. "This package alignment is staged to deliver performance leading products in a multi-source, industry standard package."