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   Date: 17th Feb 2010

Novellus, IBM and CNSE partnering to develop 22nm semiconductor process tech

Novellus Systems, IBM and the College of Nanoscale Science and Engineering (CNSE) have established a strategic partnership at CNSE's Albany NanoTech Complex targeting the development of semiconductor process solutions for 22nm and beyond nanoelectronics technologies.

The scope of the collaboration will encompass a range of photoresist removal processes, including high-dose implant strip (HDIS) processes that are compatible with high-k metal gate technology, and damage-free etch strip chemistry used for ultra-low-k dielectric structures.

The first project under this agreement is designed to enable advanced, residue-free photoresist strip processes for advanced computer chip technologies at 28nm and 22nm nodes. Photoresist stripping is a critical process step for defining the wiring in a semiconductor chip.

"IBM is committed to working with Novellus Systems and the College of Nanoscale Science and Engineering in this newly-established technology collaboration, where our initial focus is on optimizing these advanced photoresist strip technologies for our industry-leading high-k metal gate transistor structures," said Paul Farrar, vice president of process development, IBM. "Close collaboration with equipment suppliers through the consortium of world-class companies at CNSE's Albany NanoTech is critical to bringing leading-edge technology to market for the benefit of IBM and its alliance partners."

"IBM has a long-standing reputation for developing state-of-the-art semiconductor manufacturing processes," said Tim Archer, Novellus' executive vice president of worldwide sales, marketing, and customer satisfaction. "Novellus is excited to be working with IBM and CNSE in this strategic partnership focused on advancing the science of photoresist strip and clean."

"The UAlbany NanoCollege looks forward to working in partnership with industry leaders Novellus Systems and IBM to accelerate the development and deployment of innovative technologies that will support nanoelectronics manufacturing," said Richard Brilla, vice president for strategy, alliances and consortia for CNSE. "This collaboration will enable the integration of leading-edge process and equipment technologies to help address the critical needs of industry, further demonstrating the technology leadership of IBM and its alliance partners."

          
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