Date: 17th Feb 2010
Novellus, IBM and CNSE partnering to develop
22nm semiconductor process tech
Novellus Systems, IBM and the College of Nanoscale Science
and Engineering (CNSE) have established a strategic partnership
at CNSE's Albany NanoTech Complex targeting the development
of semiconductor process solutions for 22nm and beyond nanoelectronics
technologies.
The scope of the collaboration will encompass a range of
photoresist removal processes, including high-dose implant
strip (HDIS) processes that are compatible with high-k metal
gate technology, and damage-free etch strip chemistry used
for ultra-low-k dielectric structures.
The first project under this agreement is designed to enable
advanced, residue-free photoresist strip processes for advanced
computer chip technologies at 28nm and 22nm nodes. Photoresist
stripping is a critical process step for defining the wiring
in a semiconductor chip.
"IBM is committed to working with Novellus Systems
and the College of Nanoscale Science and Engineering in
this newly-established technology collaboration, where our
initial focus is on optimizing these advanced photoresist
strip technologies for our industry-leading high-k metal
gate transistor structures," said Paul Farrar, vice
president of process development, IBM. "Close collaboration
with equipment suppliers through the consortium of world-class
companies at CNSE's Albany NanoTech is critical to bringing
leading-edge technology to market for the benefit of IBM
and its alliance partners."
"IBM has a long-standing reputation for developing
state-of-the-art semiconductor manufacturing processes,"
said Tim Archer, Novellus' executive vice president of worldwide
sales, marketing, and customer satisfaction. "Novellus
is excited to be working with IBM and CNSE in this strategic
partnership focused on advancing the science of photoresist
strip and clean."
"The UAlbany NanoCollege looks forward to working
in partnership with industry leaders Novellus Systems and
IBM to accelerate the development and deployment of innovative
technologies that will support nanoelectronics manufacturing,"
said Richard Brilla, vice president for strategy, alliances
and consortia for CNSE. "This collaboration will enable
the integration of leading-edge process and equipment technologies
to help address the critical needs of industry, further
demonstrating the technology leadership of IBM and its alliance
partners."
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