Infineon and Nokia collaborated to develop advanced RF transceiver solutions for HSPA

Infineon and Nokia have collaborated to develop advanced Radio Frequency (RF) transceiver solutions for HSPA.

Nokia's licensable modem designs work with Infineon's RF transceiver solutions, to access the complete modem solutions for HSPA (High Speed Packet Access) through LTE (Long Term Evolution).

Both companies will jointly drive the interface standardization for LTE-Advanced enabling data rates of up to 1Gbit/s, providing a validated system with an open interface will enable a fast roll out of new products and increase competition in the market for advanced modem chipsets.

"We are grateful to expand our successful collaboration with Nokia beyond our current platform and RF activities," stated Prof. Hermann Eul, Member of the Infineon Management Board. "Pairing Nokia's advanced modem technology and Infineon's best in class RF transceiver solutions, will give the industry access to very competitive chipset solutions."

"Taking advantage of each company's expertise as leaders in their respective fields, this cooperation will help to deliver standard-based, industry leading solutions for mobile internet devices," said Pekka Sarlund, Vice President, Wireless Modem, Nokia.