Novellus has introduced the SABRE Excel, an advanced copper electroplating system that provides a fill and defect density performance for the 22nm technology. The SABRE Excel platform features a new deposition module incorporating Novellus' IRISCell technology, and new hardware, software and communications upgrades to the process tool's mainframe.
To address device reliability concerns at these advanced geometries, uses a thin alloy PVD seed layers where the thick PVD seed layers can cause copper voiding and the thin seed layers result in increased seed resistance, making it difficult to achieve the uniform current density required during the initial stages of electrochemical deposition (ECD).
Novellus' IRISCell technology employs field-shaping elements to enable dynamic current modulation during the deposition process. And the SABRE Excel's new plating process, called Multiwave entry, provides millisecond control of the voltage profile during the initial stages of copper deposition.
The propensity for "killer" defects has been reduced using a low-corrosion electrolyte. The number of chips per wafer has also been improved by increasing the usable die area through a reduction of the process edge exclusion to only 1mm.
"We are confident that the SABRE Excel system will serve as the new benchmark of copper ECD for advanced technology nodes," said Sesha Varadarajan, vice president and general manager of Novellus' Electrofill business unit. "The results we have achieved with the new IRISCell and Multiwave entry technologies have driven several of the industry's leading manufacturers to place orders for the system with shipments beginning in Q4 of this year."