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News |
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Date: 31 Oct 06
NXP's new family of smartcard ICs are
thinner than a sheet of paper.
NXP has announced new family of smartcard
ICs called SmartMX family, which are only 75 micrometers in
thickness. This new record is 50% thinner than the present
smartcard ICs.
These chips are developed for e-passport/Visa and such key
ID card applications. The thinness helps in to add additional
layers of security information and protective layer on smartcards.
This development is in the direction towards ultra thin smartcards
and various innovative security and identity applications.
NXP, ST Micro, and Infineon (all
Europe based companies) leading the development; in this market
of security and identification.
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