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Date: 28th Mar 07
Infineon's 130nm process technology for
HSMC fab in India
Hindustan Semiconductor Manufacturing
Corp. (HSMC), a new firm founded by US based Non Resident
Indians (NRIs) is building a semiconductor fabrication (fab)
facility in India to manufacture System On Chip (SOC) type
of semiconductor ICs for cellphone, RF ID, Automotive applications.
HSMC is getting 130 nm process technology license from Infineon
Technologies for this new venture.
Apart from 130 nm process technologies
licensing, Infineon will also provide expertise and advise
in setting up this new fab, and license its qualified silicon
design libraries. The domestic Indian market for mobile phones,
smart cards and automotive applications are expected to be
big and growing fast. Infineon's special strengths in these
areas make it a right partner for HSMC.
HSMC plans to build both 8-inch and 12-inch
wafer fabs separately. 8-inch fab with an investment of 1
billion USD is expected to churn out ICs in two years from
now. The 12- Inch fab is to follow next with investment of
USD3.2 Billion to USD3.5 Billion USD.
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