Rambus buys Inapac patents related to System-in-Package solutions

Rambus has purchased memory-device packaging patents from a company called Inapac Technology, Inc. Rambus with its range of DRAM memory IPs is intent to broaden its IP portfolio to its mobile phone and other portable device making customers.

Rambus says, these newly acquired patented innovations are key enablers for achieving high manufacturing yields in System-in-Package (SiP) implementations. SiP consists of a number of stacked integrated circuits (IC) - such as a media processor, DRAM, and Flash memory device - enclosed in a single package or module. This technology allows designers to achieve high functionality in a very compact space, ideal for mobile products such as mobile phones and mobile gaming devices. Given its performance characteristics, SiP has applicability in computing and consumer electronics products as well.

SiP technology saves manufacturing cost for OEMs by procuring modules or sub-system type of physical devices in PCB mountable package. Inapac's SiP patent named SiPFLOW is expected to increase the assembly yield in SiP devices. Industry-leading reliability rates of less than 100 defective parts per million (DPPM) have been achieved in high-volume SiP containing a DRAM and media processor.

Motorola RAZR V3i and the Sony Ericsson C902 mobile phones have used these patented innovations through separate technology license agreements with Inapac.