18th Feb 09
Nokia selects Broadcom as a next
generation 3G chipset supplier
Nokia has selected Broadcom semiconductors as its next
generation 3G base-band, radio frequency and mixed signal
chipset system supplier for worldwide markets. The two parties
will cooperate on technology, including Nokia modem technology.
"We are very pleased to have been selected by Nokia
as a 3G HSPA supplier leveraging Broadcom's strengths in
mixed signal, multimedia and cellular platform technologies,"
said Scott McGregor, Broadcom's President & Chief Executive
Officer. "We look forward to developing great products
and continuing to build upon our existing relationship to
help Nokia realize their mission of 'Connecting People'."
"Today's announcement with Broadcom is a further example
of Nokia's commitment to our diversified, multi-supplier
chipset strategy," said Kai Oistamo, Executive Vice
President, Devices, Nokia. "This agreement, which targets
low cost, high volume markets, demonstrates that we view
Broadcom as a reliable supplier to bring the benefits of
3G to Nokia customers around the world."
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