Ramtron to make its F-RAM chips using IBM foundry

F-RAM memory pioneer, Ramtron has entered into a foundry services agreement with IBM. The companies plan to install Ramtron's F-RAM semiconductor process technology in IBM's Burlington, Vermont, advanced wafer manufacturing facility. Once installed, the new foundry supply will serve as a foundation for the introduction of new and cost effective high-performance F-RAM semiconductor products.

"We look forward to increased manufacturing capacity through our foundry relationship with IBM to help meet the growing demand for Ramtron's unique F-RAM semiconductor products," said Bob Djokovich, Ramtron COO. "This new world-class foundry will provide a flexible and cost effective manufacturing platform for our new product development initiatives, which will drive new market opportunities for Ramtron. We have high confidence in IBM Microelectronics and believe that the addition of their process development and foundry services will help Ramtron serve the future needs of F-RAM customers around the world."

"We are pleased to help facilitate the expansion of Ramtron's F-RAM product offerings," said John DiToro, vice president, semiconductor manufacturing, IBM Systems and Technology Group. "The vast array of IP blocks available through IBM foundry services can provide Ramtron with a great deal of product development flexibility. We look forward to working with Ramtron to help the company reach its manufacturing and product development objectives."

Ramtron expects to generate first production wafers during 2010 on the IBM 0.18-micron wafer manufacturing process. IBM will become Ramtron's third foundry supplier for its F-RAM semiconductor products, along with Fujitsu Limited and Texas Instruments.