Infineon and Micron to develop high-density subscriber identity module (HD-SIM) cards

Infineon and Micron are collaborating to develop high-density subscriber identity module (HD-SIM) cards reaching beyond 128 megabytes (MBs).

HD-SIM cards are ideal for delivering expanded storage and greater services for mobile applications while improving the operator's processes. Combining high density with improved security enables operators to offer graphically rich, value-added services such as mobile banking and contact less mobile ticketing. Further, operators can securely update or delete applications through their wireless network while new applications, services and settings can be downloaded or pushed to the HD-SIM at any time to maintain fast time-to-market. However, this growth in functionality also means that storage solutions for the SIM need to keep evolving to take advantage of faster processing and communication speeds, ultimately delivering the higher memory capacity that these applications require.

To answer these needs, Infineon and Micron will develop an innovative, high-density solution. Working in close technical collaboration, both companies are leveraging their respective expertise to architect modular chip solutions that combine an Infineon security microcontroller with Micron's innovative NAND flash memory with features designed specifically for HD-SIM applications. Micron will manufacture the NAND on 50-nanometer (nm) and 34-nm process technology. The joint solution is designed to be efficiently integrated into HD-SIM cards and will enable these cards to effectively reach beyond 128MBs of capacity and offer a host of other new features, including:
High Density: Serial NAND Flash memory provides the most cost-effective solution for 128MBs or greater capacity on HD-SIMs.
ECC (error correction code) Circuits: Incorporated internally on the Micron NAND to relieve the data error correction burden from the HD-SIM microcontroller and streamline the overall security design.
Superior Power Management: Designed for European Telecommunications Standards Institute (ETSI) compliance. The Infineon/Micron HD-SIM solution operates across the voltage range of 1.8-volts to 3.3-volts, complying with ETSI's recommendations for low-operating current.
Easy Migration: The security microcontroller concept includes an optimized and cost effective packaging solution allowing for easy migration between NOR- and NAND-based technologies as it features an aligned application protocol interface (API) and related software stack. Also, operating system software developed for existing SIM cards can be easily reused.

Prototypes are expected to be available in fall of 2009 and will be sold in die form or in an economic chip card IC package.