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Archived News of year 2009

December 2009

MEMC Electronic Materials acquire ownership stake in Eversol

GE and Metso collaborates to resell Metso Device Asset Management Solution

Tejas Networks won Deloitte Tech Fast 500 Asia award fourth time in a row

Ravi Swaminathan appointed as MD and VP of Sales and Marketing for AMD India

Walden C. Rhines to present keynote at the International VLSI Conference in Bangalore

Mentor received the IPv6 interoperability approval for its Nucleus V.6 networking stack

Broadcom reaches settlement in stock options class action lawsuit

SunEdison and Xcel Energy wins a deal for five photovoltaic solar installations in New Mexico

QSound Labs join in the ARM Solution Center for Android

Avaya completes the acquisition of Nortel Enterprise Solutions

Kyivstar GSM selects Alcatel-Lucent to power all-IP network transformation in Ukraine

Eurotech wins 1.2M USD contract to supply embedded computers

Redbridge deploy BridgeWave's gigabit multiple wireless links in its video surveillance system

Infineon and Fairchild Semiconductor settle patent dispute on power transistors

PICMG announced new specifications for CompactPCI and AdvancedMC

Year 2009 is not that bad for memory chip makers and 2010 going to be even better

40nm 2-Gigabit DDR3 SDRAM volume production shipment from Elpida

65nm XS Version 1-Gigabit DDR3 SDRAM from Elpida

Biometric security solution replaces passwords with the scan of an employee's palm

Atmel integrate Immersion's TouchSense touch feedback tech into its touch devices

PICMG adopts PICMG 2.30 for cPCI and AMC.4 specification for AdvancedMC

WD and NEC partnered to raise USB 3.0 standard with new storage interface tech

Fairchild Semiconductor's LED driver drives OSRAM's LED products

Rambus acquire GLT's patents on lighting and optoelectronics tech

Atmel collaborates with H&D to deliver power efficient embedded Wi-Fi solution

Not to miss event on semiconductors; VLSI conf. on Jan 3-7 2010 in Bangalore

High power three-phase bridge rectifier modules from Microsemi are DSCC qualified

Sony and RealD collaborated to offer immersive 3D home entertainment

ST Micro engages solidly with Indian power semiconductor market

QNX Neutrino RTOS supports Cavium's OCTEON Plus multi-core processors

Dell'Oro Group reports high-speed server network soars in the third quarter 09

Marvell's ARMADA 1000 SoC won "Best Media Processor System-on-Chip" Award

EMU In-Home Display from Rainforest earns ZigBee Smart Energy product certification

Over 500 million SmartMX security chip shipment from NXP semiconductor

ITM selects Broadcom's Bluetooth tech for its hands-free car kits

Upgraded tech from broadcom to enhance bluetooth and Wi-Fi co-existence in notebooks

UMC presented new hybrid high-k/metal gate tech for 28nm at 2009 IEDM

Dell'Oro reports 10% of decline in China mobile infrastructure market in third quarter 09

Dr. Tinku Acharya is elevated to IEEE Fellow for his contribution to image processing

MATLAB; an essential tool for a serious engineer

Interaction with Xilinx-India CTO on FPGA design issues and trends

XtremeData deploy Altera's Stratix IV FPGAs into its dbX Analytics appliances

Digi-Key to distribute Torex' power ICs

LSI and Wichita State University launch Center for Storage Networking Research

Alcatel-Lucent increased its IP router market share by four percent

Premier institutes MIT, Carnegie and Purdue joins cybersecurity research consortium

Battery less TV remote control from NEC and Soundpower

AMD and SiSoftware collaborates to develop OpenCL GPGPU benchmark suite

Elpida receives "2009 Global Warming Prevention Activity Award"

Sogitec certified AMD's synchronization modules and 3D graphics accelerators

India's new solar mission opening a floodgate of opportunities

Mitsubishi selects ADI's SHARC processor for its automotive digital process center

AWR incorporates AMPSA's multimatch amplifier design tech into its microwave office

Towerstream deploys BridgeWave's 80 GHz links into its WiMAX backhaul network

Airspan's WiMAX products are FCC certified

Panasonic and SEAS-NVE collaborated to improve house energy usage remotely

Given Imaging's camera capsules employs Zarlink's wireless RF chip

Broadcom acquires Dune Networks to get into cloud computing

Epson Imaging's TFT LCD business sales function transferred to the Sony Group

e2v's Centre for Electronic Imaging in collaboration with Open University

Automotive-grade semiconductor manufacturing by TSMC

Record level sales of PON equipment according to Dell'Oro report

"Understand digital power in one day" hands-on technical seminar by Intersil in Germany

November 2009

Surge protection devices from Emerson meet UL safety standards without need for modifications

Emerson Network Power expands VME board portfolio with new ruggedized models

MEMS microphones from ST in the price range of electret microphones

3D Systems acquires AdvaTech's manufacturing to extend its 3Dproparts targeting military apps

China Telecom selects Alcatel-Lucent to deploy first commercial WAP & WEB Gateway

There Corporation is new partner of Z-Wave Alliance

AeroScout's Wi-Fi RFID solution powering Ultimo's hospital software

Infineon and Nokia collaborated to develop advanced RF transceiver solutions for HSPA

DENSO designed and tested its robotic arms by using NI's measurement tools

Mitsubishi's LCD TV with Blu-ray disc recorder employs Marvell's Qdeo chips

Online video-rich tutorial on DC power supply circuit design from PI

Digi-Key to sell Tusonix line of products from CTS

MEMC Electronic Materials completes the acquisition of SunEdison

Researchers can access MATLAB on TeraGrid

New Telefónica HSPA+ network deployed with Sierra AirCard USB 307 modem in Spain

Microsemi's high power single-phase rectifier bridge modules are now DSCC qualified

Mitel Networks adds Microsemi's PowerDsine to its DataNet portfolio

Atmel expands its 6-pin AVR Microcontroller family

Motorola gains push-to-talk advantage by acquiring RadioFrame's iDEN products

Austriamicrosystem expands Multi Project wafer prototyping service

CDMA and WCDMA patent arrangement agreement by MediaTek and Qualcomm

Roti maker, bone screws, and website security wins Silicon Valley Entrepreneurial Awards

Dune and NetLogic validated the interoperability between their products

FormFactor qualifies one-touchdown 300-mm wafer probe card for DRAM sort test

Ericsson announces completion of Nortel's acquisition in North America

EDGE Evolution software from Ericsson adds 3G capabilities to GSM networks

12 design wins for Continuous Computing's DPI tech from network equipment providers

YM Krishna SSK produce renewable energy by employing GE Fanuc's control system

FlashCORE III programming solution from Data I/O wins 2009 global technology Award

Mutare selects Ditech's PhoneTag automated voicemail-to-text service

Hand gesture based interface for remote control of TV

Toshiba to expand use of Cadence tools for SoC design

TowerJazz and Tanner EDA to deliver PDK for power management IC design

Aptina did post layout verification of its image sensor design using Fast 3D software

Toshiba develops new photoresist tech for 20nm semiconductor fabrication

Toshiba Semiconductor is transferring its chip assembly facility to Nantong

Broadcom supports WAPI in its WLAN ICs

NXP wins Sanmina-SCI's best supplier award

Agilent's new 1-Megawatt Solar Power System to save $3.5 million in energy costs

Symmetry to distribute Fujitsu's chip in Americas

Hynix Semiconductor's 2Gb DDR3 DRAM devices Validated by Intel

Semiconductor equipment Book-to-Bill ratio above 1 from Jul to Oct 09

Semiconductor packaging materials market to reach $20.1 billion by 2013

DRAM test lab opened in Munich Germany

Cisco and HP lead in fixed 10 Gigabit Ethernet switch segment

National Micro. Institute names Powervation as best semiconductor startup up of the year

Intel invest to built 1000 times more powerful of current supercomputer

Westcode Announces New 'Megawatt' press-pack IGBT transistors

Advanced semiconductor chips at a price of a dollar and less

Semiconductor revenue to drop by 11.4 percent in 2009: Gartner's reviewed estimates

Learn about LabVIEW at NI's conferences in Indian cities

Applied Materials buys advanced semiconductor packaging expert Semitool

Digital Imaging achieve first-pass silicon success in 22 days

Intel and NEC join hands to develop supercomputer technologies

DNP, MPI and Sony develop smartcard using biodegradable plastics

IP and patents are the gold reserves of the semiconductor industry

Intel and AMD race neck to neck in supercomputing domain

IEEE sponsored HTC workshop discuss challenging technologies

Videocast to learn techniques of powering Xilinx FPGAs

Over a billion SoCs integrate flash memory interface IP components from Arasan Chip Systems

ST Micro's contactless chips to have NXP Semiconductor's technology

Sigma completes acquisition of CopperGate Communications

Micronas and University of Freiburg gets "f-cell Bronze Medal" innovation award

ABI position NXP Semiconductor at number one in contactless IC market

Touch Micro-System employ Rudolph's software to improve yield in MEMS devices

Silicon Frontline's post-layout verification tool is validated by UMC and TSMC

Tanner EDA partner with SoftMEMS to support chip designers in India

Marvell's semiconductor innovations in India targets broadband connected smart gadgets

Element14 launched online resource for Microchip's XLP MCUs

Agilent and Nexus deliver DDR3 memory bus debug solutions

IO-Link reference design jointly by Atmel, HMT and MESCO

Cavium Networks to acquire MontaVista Software

GigOptix has acquired fables mixed signal IC supplier ChipX

Record shipment of processor chips in 3rd quarter 2009

India targets 20 giga watts of solar power by 2022, AP leads

A team formed in Europe to develop capacitors inside semiconductor chips

Marvell and E Ink collaborated to develop processors for e-readers

Internet audio growth to drive demand for Class D and class G/H amplifier ICs

Mentor Graphics to unify silicon test and yield analysis

Indian Telecom market: ITI and Intel right match for growth of wireless broadband n/ws

ST Micro and Mayo clinic collaborate on remote patient monitoring technology

Infineon and TSMC are partnering to jointly develop 65nm embedded flash process

Realtek continues to buy Synopsys EDA tools

Elpida share DRAM technologies with ProMOS in exchange of Foundry Services

ON Semiconductor reports 13% sequential growth in revenue in 3rd Q 2009

Semiconductor revenues to drop by 11% in year 2009: SIA forecast

John Kelly wins Robert N. Noyce award for his contribution to Semiconductor Industry

NI Expands HIL simulation platform for embedded control systems apps

SEMI powers IC buyers to counter chip counterfeits with new standards

Samsung stacks 8 32Gb NAND flash dies to form 0.6 mm thick single device

Market study says SiC & GaN devices to impact discrete power semiconductor market

Avago's critical IP enables Juniper Networks' development of silicon devices

Newton selects Broadcom's Bluetooth tech for its MoGo Talk wireless headset

17% of growth in silicon wafer area shipments in third quarter 2009

Advantech supports Windows Embedded CE 6.0 R3 RTOS

SEMI released database of Opto and LED manufacturers

ST Micro and LG Display collaboration unveils iDP interface standard for LCD TVs

Low resistance tungsten metallization process for semiconductor chip manufacturing

IBM's x servers employ LSI 6Gb/s SAS technology

Raytheon awards TriQuint with a 4-Star Supplier Excellence Award (SEA)

FXI and Atmel develops microSD gaming console for mobile phones

Semiconductor assembly and test services provider Unisem's 3rd Q revenue grew by 11.1%

WCDMA power amplifier from Anadigics powers Samsung's 3G Handsets

Aldec opens new office in Bangalore, India

SAMSUNG to collaborate with Microsoft to save energy

Tower Semiconductor outperforms global semiconductor fab business

Semiconductor industry's fast recovery in 3rd Q 09 is due to processor and DRAM demand

Delta Networks taps Indian telecom and networking equipment market

October 2009

Vishay Nobel is now a partner of Schneider Electric's CAPP

Jennic demos low-power ZigBee with the energy harvested from an electro- mechanical switch

Onzo to develop consumer displays for Echelon's utility metering services

Widex employs Mentor's analog/mixed-signal simulators to design its wireless chips

NVIDIA adopts Synopsys Yield Explorer to reduce time to volume

Agilent and Stanford University collaborating to explore new class of nanoscale devices

Return path receiver with DOCSIS 3.0 performance from Alloptic

Due to faulty plastic molding Belkin recall its SurgeMaster surge protectors

Enablence sign $3.5 million agreement to develop PLC based components for NGN apps

Cadence low power design flow for SMIC 65nm process

Mitsubishi selects eASIC's Nextreme ASICs for its Display Wall Cube Systems

Trident adopts Mentor's Veloce platform for system-level verification of its digital TV SoC

FormFactor unveils 300-mm TouchMatrix probe card for NAND Flash devices

1 million Mustang EPON ONU chips shipped by TranSwitch

Open Verification Methodology cookbook from Mentor Graphics' s Mark Glasser

Indilinx, Cavium and Narinet collaborated to bring SSD into networking storage systems

Intersil and Georgia Institute of Tech joint alliance for semiconductor development

Intel and Numonyx achieve stacking of PCM arrays to increase memory capacity

Microsemi to close manufacturing facility in Scottsdale, Arizona

15 -20% sequential growth of world's semiconductor revenues in 3rd Quarter of 2009

Aurora PVIDESKTOP platform from Power-One for Aurora Photovoltaic Inverters

MEMC to acquire SunEdison

Sharp develops 35.8% conversion efficient solar cell by using triple-junction compound

Cray adopted Denali's Databahn PCIe 3.0 controller core and PureSpec verification IP

Intrinsyc's Windows Embedded CE 6.0 R3 with CerfBoard 270 reference designs

ST adopts ARM Cortex-A9 MPCore processor for its home entertainment equipment

BSNL connectivity, HCL computers and Intel chips and tech; a powerful combination

NXP and Avni collaborate to develop LED based street lighting solutions for India

Open-Silicon, MIPS and Virage Logic achieves 65nm ASIC processor design

Medical electronics firms employ advanced Bluetooth to access patient data wirelessly

National Semiconductor adds more distributors for its PV solar solutions

Circuit Emulation products from Zarlink semiconductor wins MEF 18 certification

LSI and Supermicro collaborates to offer end-to-end 6Gb/s SAS solutions

Carrier Grade QuickSec 5.0 toolkit integrates Cavium Networks OCTEON and Multi-core support

ARM and Mentor collaborates to support Nucleus RTOS/Graphics software

CoWare partners with ARM to provide AMBA Network Interconnet based SoC designs in SystemC

Cadence and ARM joining hands to develop SoC design flow

Ericsson and Samsung working together to make their LTE devices and networks interoperable

E Ink and Freescale are partnering to develop embedded processors for eBook market

Aeroflex / Metelics wins DSCC Certification for their small signal zener diodes

Ixia to acquire Agilent's N2X Data Networks Product Line

Novatek licenses the MIPS32 24KEc processor to power SoC designs for digital home

NIST adopted CableLabs SMA specifications for its Smart Grid networks

TSMC opts for Mentor's Calibre physical verification platform for its Integrated Sign-off Flow

Single-chip STi5197 cable STB decoder IC from ST Micro is opted by Chinese STB vendors

Methanol fuel cell based external power source from Toshiba for mobile devices

Semiconductor revenue update: a bit of motivating figures

New Mobile Memory Initiative with breakthrough power efficiency from Rambus

European research project "BioP@ss" aims to develop electronic ID card in chip card format

ADT security services is the new member of Z-Wave Alliance

New ALR-9900-EMA reader from Alien deploys EPC Gen 2 RFID solutions

SP AusNet select Motorola's mobile broadband tech to power WiMAX-based smart metering apps

Extreme Networks and Motorola collaborates to provide secure, fast 802.11n services

SAMSUNG Electronics' TV chip for North American mobile digital TV

Newark to sell, support and stock austriamicrosystems' Analog ICs

CTS wins $22 million production program from Japanese automotive manufacturer

Cavium's processor powered TeamF1's security gateway drives Netgear's VPN firewall

MontaVista now supports 4G wireless networks with OpenSAF capabilities

Novellus unveils SABRE Excel platform for 22nm copper electroplating

MagnaChip offers 0.11um, 30V process technology with small SRAM cell size

Octasic's enhanced Vocallo MGW multicore processors support advanced video features

Logic Devices is sampling its first DDR2 DRAM modules

TriQuint wins $16.2M DARPA contract to develop GaN circuits for defense/aerospace

UMC completes EPD verification for its 200mm IC wafers

Joint collaboration enables ARM processor and intrachip bus IP on Xilinx FPGAs

New China website launched by Exar

Cochlear and NXP collaborates to design Cochlear's Hearing Implant devices

Cray selects Gennum's Snowbush PCIe 3.0 PHY IP for its supercomputer design

NXP Semiconductor and Infineon are sharing much of the ePassport market pie

GLOBALFOUNDRIES picks Mentor for IC manufacturing related EDA software

BittWare Receives Production Order for NG STARLite Program

Wind River VxWorks MILS Platform 2.0 for GE Fanuc's single 3U VPX computing platform

GE Fanuc secured $1 million order to upgrade Northrop Grumman's IAS

Pace Embedded Systems Lab at R.V. College of Engineering, Bangalore India

SMIC extend its 45nm CMOS technology to 40nm and 55nm

Qdeo video processors from Marvell win 2009 TV Innovation Award

New standard from SAE to enable Ethernet for critical embedded systems

Audi's car audio systems powered by NXP's HD radio chips

Joint hardware and software platform for IPTV over broadband network

New memory cards from Samsung Electronics are introducing in this month at Taiwan

Quanta selects Tilera's 64-core processor for cloud computing

IBiquity selects Atmel's AVR Microcontrollers for HD radio reference design platforms

New Innovation to boost efficiency of fuel cells from MIT team

LG Electronics implements Rayspan's metamaterial antenna in its mobile phones

Aeroflex adds new LTE measurement capabilities to its PXI platform

Marvell supports new "Wi-Fi Direct" standard for 802.11 WLAN devices

AMIMON employ Sidense's OTP tech in chips used for WHDI

GigOptix now shipping pre-production quantities of 40G EO polymer modulators

Sigma Designs to acquire CopperGate Communications

Notebook and netbooks propel Intel back into growth path

Aeroflex 3280A spectrum analyzers added with 30 MHz digital demodulator at no extra price

Infineon maintains number one position in Chip-card semiconductor market

Mentor Graphics to acquire PCB manufacturing software vendor Valor

IPTV set-top box from Amino now powered by Intel Atom based CE4100

TSMC-qualified Electromagnetic simulator from Agilent for RF design in 65 nm process

Instat says GPS enabled phones to capture PND market opportunities

NXP Semiconductor and Virage Logic go for a long-term give and take relationship

Joint strategic initiative from AMD and CyberLink to accelerate CyberLink apps

Allegro MicroSystems phasing out its wafer fab operations by mid-2012

Incap plans to extend its design unit in India

Radio platform streaming new-gen Internet content from Ensigma and Imagination Tech

Researchers getting closer to integrating nanowires on CMOS semiconductor chips

Fresco are Entropic are partnering to develop hybrid receivers for modern TVs

UMC Fab 12i migrates its manufacturing process to 45/40nm

Microsemi wins $2 million contract to develop SiC RF components for Avionics apps

Joint RF4CE development platform from TI, C.G. Development and Quanta

Echelon and Eaton collaborate to provide Smart Grid solutions in homes

Joint strategic initiative from AudioCodes and BroadSoft for IP voice network solutions

ST Micro's first-pass silicon success by utilizing Synopsys DesignWare solutions

Cavium's NITROX PX security adapters deployed in Hitachi's blade server systems

Elpida memory completes the development of the 40nm 2-gigabit DDR3SDRAM

GE Fanuc deploys NVIDIA graphics processing units (GPUs) on its new hardware products

JDSU shipped more than 100 Q Series UV lasers for the scribing of LED wafers

NREL adopted Synopsys' Sentaurus TCAD to simulate solar cell performance

Dongfeng employs MathWorks tools to design hybrid-vehicle battery system

More than 8,000 instrument drivers through Instrument Driver Network from NI

DSCC qualification granted to Microsemi's SMT power schottky diodes

Novellus extend SPEED Max STI manufacturing process to 32nm technology node

Dialog Semiconductor's ICs to power-manage NEC's multimedia processors

ORBCOMM selects Sierra Wireless for its M2M web services platform

Philips IntelliVue Patient Monitors wins Aruba's interoperability certification

Enel selects ST Micro chips for its electronic power meters

Premium Wi-Fi Service jointly by Qualcomm and Wandering

Joint AUTOSAR 3.0-compatible solution from NEC Electronics and KPIT Cummins

Freescale and ST Micro together launched 32-bit MCU for automotive electronics

Trident acquires NXP Semiconductor's TV and STB IC business in exchange of Trident's stocks

PERC Java virtual machine supports BeagleBoard for real time embedded systems

Quatech acquires Socket Mobile's SocketSerial devices business

0.18 micron CMOS process from ON Semiconductor for digital and mixed-signal ASICs

Eurotech received $1.8 million order from Cadec for fleet management embedded tech

PDK for GaAs pHEMT and HBT process from AWR and WIN semiconductor

Microsemi joins PoE technology consortium

'Common Platform Technology' qualifies Synopsys IC Validator for 32-nm design rule

Broadcom's Wi-Fi reference designs are selected for the Wi-Fi CERTIFIED n Test Bed

Panasonic and Renesas collaborating on 28-32nm SoC process tech at Renesas Naka site

Jade graphics chip from Fujitsu powering 'virtual image' cluster of Jaguar Range Rover

McObject's eXtremeDB embedded DB software is selected by defense/aerospace industry

Accellera approves an interoperability guide helping design re-use of IP components

Joint development of LTE based mobile-terminal platform

CTS to supply throttle position sensor to one of the India's leading motorcycle maker

Sierra Wireless integrates Anyware Tech to enhance its M2M solution capabilities

Radiocrafts and Sierra Wireless jointly launches gateway for smart meters

September 2009

Pyxis Technology gets 3 million funding from four different VCs

Availability OF CMD made 65xx microprocessor replacements by WDC/DEMA

ADI Blackfin DSP to power UTAS patient monitoring systems

IR's DC-DC Converter IC ART2815T is on-board Planck spacecraft

New standard to emerge for streaming digital media content on TVs from mobiles

Supermicro Launches AMD Istanbul based server, blade, and workstation computers

TriQuint Semiconductor focusing more on broadband connectivity enabling devices

Samsung producing 512-Megabit nonvolatile memory PRAM

TranSwitch gaining design wins in Asia for its Atlanta communication processors

Kyocera is strategically investing in sales and divesting its Indian R&D resources

Enea's OSE multicore edition RTOS supports Cavium's OCTEON plus processor family

TSMC to make AMCC' power architecture based processors on bulk CMOS process

Physically active but shy girl-robot from Murata

Qosmos ixEngine to support Tilera multi-core processors

DIP International to sell Octasic chips in Europe

TSMC to produce Fujitsu's semiconductor chips at 28nm process node

New Scale's ASICs are now sold by austriamicrosystems

Sony has sold 1 million PlayStation3 gaming systems in 3 weeks

CTS is the EMS partner for manufacturing Thales' defense electronic products

Advantech supports Moblin OS with fast boot funtion

Cypress Semiconductor's LED controller chips inside WAC's LED light system

Altera started shipping 40-nm Stratix IV GX FPGAs

Sony selects Marvell's video processor to power its Blu-ray Disc MegaChanger

General Motors and Reva partnership to enhance Indian automotive electronics market

ARM Cortex-M3 based ZigBee development and debugging platform for Embedded apps

Phoenix's Hyperspace aligned with Moblin v2 Technology for Intel Atom based devices

Intel Atom developer program for ISVs and developers targeting netbooks, mobile apps

Microsoft Windows 7 Touch Logo now certifies SiS capacitive touch panel controller

TNT Innight embarks on major RFID field test with NXP and IPEX Group

X-FAB adopted Agilent's IC-CAP device modeling platform for DC and RF apps

Mantaro partners with Tilera to develop their services for high-end computing solutions

IR to display its new power management solutions at CEATEC JAPAN 2009

LSI demonstrates single-root I/O virtualization solution at Intel Developer Forum

Semiconductor industry is cautiously optimistic on next phase of growth

Semiconductor chip based authentication to prevent cloning of e-gadgets

IBM's on-chip DRAM prototype technology achievements

New Firmware Catalog for Actel's embedded processor development tool suite

Intel's Design Expo to bridge mobile technology for student designers

Microsoft Windows Embedded CE 6.0 R2 training course by Atmel and Adeneo

PV Group forms new standards committees in Japan and Taiwan

Huawei to procure Triquint's optical driver amplifiers for it optical transport system

NXP and Skymeter are partnering to offer road-use metering technology

Paul Grimme is now VP and GM of ST's automotive products

Nanotech based battery innovation by MIT scientists for bigger and longer storage

CAP-XX study compares white LED flash with Xenon

UMC audits carbon footprint for its IC wafer production facility

Microchip offering exchange programs for your old MCU development tools

HyperSpace OS is to be bundled with Intel Atom based motherboards

Quadros to ship ARM RealView dev. suite with RTXC RTOS and integrated software

Flash download option for J-Link from SEGGER for free

IR's radiation hardened DC-DC converter is used in Planck spacecraft

Moser Baer is quickly gaining share in USB flash memory market

DDR3 based threaded module prototype for multicore computing

Agilent Technologies is rated as best place to work in a survey

AT&T and Intel collaborate in providing remote system admin services to SMEs

Open standards for manufacturing masks used in semiconductor equipment

Panasonic developed a robot becoming either a bed or wheelchair

Wind River's MIPS architectures complies with Carrier Grade Linux 4.0 specs

Wipro ranked as number-one semiconductor global R&D service provider

Digi-Key signed a global distribution agreement with XMOS

Blackfin based IP media development kit jointly developed by ADI and Arcturus

ZTE selects LSI SP2600 media processor solution for wireless applications

Synopsys has added Sunplus to its list of customers called 'primary EDA partners'

Peregrine Semiconductor records a shipment of 500 million UltraCMOS RFICs

Microsemi's radiation hardened medium power transistors gets DSCC qualified

Cypress embed ARM cores in new version of PSoC devices

Good news for embedded system designers with expertise in PSoC and ARM

Samsung adopting Skyworks' RF front-end devices to power its 3G mobile handsets

Agilent's expands its serial J-BERT N4903B for 16x fibre channel transceiver testing

Fujitsu is now shipping SAW filter-less 3G transceiver for mobile phones

TSMC characterizing its sub-40nm memory IP with Synopsys HSIM simulator

Computation capability enhanced Matlab and Simulink support multi-core systems

India UK Semiconductor handshake; where it can be strong?

Atheros to acquire Intellon to expand its network device domain

Entropic and ViXS Systems joined to develop MoCA enabled, NAS reference design

Myriad's homescreen widget solution for low cost mobile phones

iSMART's high-speed DSM L3 range and speed-multiplying technology

ST's Demonstrator platform for hybrid broadcast and broadband set-top boxes

ADI's blackfin is selected by Rigol to power its oscilloscopes and spectrum analyzers

Broadcom and SoftAtHome partnering on hybrid-IP set-top box solution

Ramtron settles product defect claim of its memory product

Marvell lauds China opportunities for its future growth

Micrium's Jean Labrosse written a new book on uC/OS-III Real-Time Kernel

Fujitsu selects AMCC's QT2225, a dual port XAUI-to-10GBASE-KR PHY IC

Network Equipment Technologies selects Wintegra's UFE3 for its multi-service platform

Popular solar industry event Intersolar to happen in India

Sanmina-SCI and OneChip Photonics are partnering to manufacture optical PICs

Freescale's new unified common platforms enable 3G to support LTE and other 4G standards

New consortium to drive automotive DSI bus standard for automotive electronics

Zarlink's VE880 chipset powers Gigaset mobile convergence product

Shift in semiconductor fab business model impacts semiconductor chipmakers

Ready reference design for residential-gateway middleware from Jungo and Broadlight

Popular solar industry event Intersolar to happen in India

Sanmina-SCI and OneChip Photonics are partnering to manufacture optical PICs

Freescale's new unified common platforms enable 3G to support LTE and other 4G standards

New consortium to drive automotive DSI bus standard for automotive electronics

Zarlink's VE880 chipset powers Gigaset mobile convergence product

Shift in semiconductor fab business model impacts semiconductor chipmakers

Synopsys offers EDA software license to IIT Kharagpur through its Charles Babbage Grant

LSI and Aricent extends their collaboration to next-generation wireless/wireline networks

Jointly developed/tested technical specs for value-added IMS network services

New AUTOSAR 3.0-compatible solution for various hardware platforms

SPMT's abridged technology specifications for mobile devices

Cash rich ATIC acquiring Chartered to accelerate growth in semiconductor world

Isuppli predicts >50% growth for 5 of the top 10 solar semiconductor suppliers

Tilgin's TR-069 with Amino's IPTV set-top boxes (STBs) for triple play home solutions

Aruba's FIPS 140-2 validated 802.11n solution for secure wireless networking apps

Dow-Key Microwave receives GOLD supplier award from Northrop Grumman

New software framework for embedded platforms from Eurotech

Barco's JPEG 2000 IP core supports 40nm FPGA platforms

Zarlink and Tollgrade combined test solution to improve triple-play service reliability

Samsung's LCD HD panels are powered by NXP's PNX5120 video co-processor

Humax picks Broadcom's BCM3556 DTV SoC for its DVB based platforms

TriQuint acquires TriAccess to offer devices capable of triple-play services

64% growth in fab spending predicted by SEMI's world fab forecast

Semiconductor companies realizing the potential of Indian SMEs in non-metros

Broadcom continue to have a strong hold on high-speed Ethernet devices

Windows 7 based windows embedded software available for downloading

Microchip selects Kolkata for it's embedded designer forum event in India

Kontron AG opened new sales and support offices in India

Zarlink's VE890 Chipset to link with AudioCodes' Tulip AC494/5/6 ATA

Smartbook was the top attraction at Freescale Semiconductor's event in Bangalore

European co-operative effort called IMPROVE to advance semiconductor manufacturing

Sony to transfer its US LCD manufacturing assets to Hon Hai


August 2009

BFi OPTiLAS to distribute Melexis products in Europe

Approved C-coded embedded software from Tata Elxsi for Tensilica's DSP ConnX D2

Synfora acquires SoC design tool Esterel Studio from EstrealEDA Technologies

Murata takeover Panasonic's multi-layer ceramic capacitor business

FlexRay is gaining ground as an accepted automotive bus interface

LSI retained its top position in Host Bus RAID Controller market with further growth

ZF Electronics TVS to sell CTS' components in India

Fluke Networks has acquired WLAN security specialist AirMagnet

Cryptography-Research locking Atmel's microcontrollers against DPA attack

No quarterly surprise for semiconductor market

Ramtron secures $6 million credit from Silicon Valley Bank

Conexant has sold its broadband access product lines to Ikanos

Airmagnet say Cisco's WLAN AP can be skyjacked

Microsemi sold the assets of Semicoa to settle US DOJ Suit

Taiwan semiconductor fabs showing more love towards sun and light

Formation of world's 3rd largest semiconductor company is postponed till Sept 09

IR quarterly sales revenue up by 16.2%

Renesas picks Synopsys Proteus OPC for 45-nm node production

e2v to present ASIC design paper at Eurosensors Conference

A new M2M solutions JV named nPhase by Verizon Wireless and Qualcomm

New EMI test receiver with a frequency range upto 7 GHz from R&S

8.5 GB DVD media launched by the Moser Baer

NEC Electronics licenses HD technology from DivX

Slight increase in quarterly revenues of Analog Devices in 2Q09

Jazz Semiconductor replacing GaAs RF component process with SiGe process

GE and Fanuc decide to separate their long time industrial systems JV business

Core Logic licensed ARM Mali-400 MP GPU targeting high-end portable devices

New software version for Aeroflex 3900 series digital radio test-set

Kyocera opens sales office in Gurgaon, India

austriamicrosystems' MEMS microphone analog IC records 1billion shipments

Infineon again lead in the discrete power semiconductor market

IBM researchers use DNA to assemble nano-switching devices on a semiconductor chip

Wafer probe card from FormFactor has achieved more than 15 million contacts cycles

Entropic is demonstrating UPnP at CableLabs Conference

PyCells studio of Ciranova crosses 1000 downloads

New software framework from Aricent for multimedia rich consumer devices

Parvus designed computers on-board Excalibur UAV

Tata BP Solar and NXP partnering to develop products by using combined technology

National Instruments and SolidWorks jointly offering solutions for mechanical design

Infineon's wireline division acquired by Gloden Gate Capital is named as LANTIQ

Rohde & Schwarz enters broadband amplifier market

Microsemi's radiation-hardened MOSFETs granted space-level qualification

IDT goes fablite by passing the chip fabrication work to TSMC

High bandwidth PXI Digitizer jointly developed by NI and Tektronix

Toshiba is shipping 43nm NAND flash in volumes to laptop OEMs

Advantech receives class 1, division 2 certification for industrial Ethernet switches and media converters

Amino's A130M HD set-top box wins TMC 2009 IPTV Excellence Award

Cosmic Circuits appoints Jose-Maria Moniz as Vice-President Worldwide sales

Intersil gained a key noise killing technology by acquiring California based Quellan

79% quarterly growth in silicon semiconductor wafer shipments in 2Q09 but not yet crossed 2Q08 mark

CUI’s wall plug and desk-top power supplies now sold under it's V-Infinity division

Amid heavy-loss Panasonic's semiconductor and devices revenues up by 25% on q-o-q basis

Huawei picks LSI's media processor chip SP2600 for its telecom infra systems

Intel's new idea to tap severely unused processing power

Spice- a-circuit 1000 times faster by using behavioral modeling tool Arana from Orora

Entropic's TV and STB tuner ICs are made at Jazz Semiconductor's RF CMOS fab

No major change in Wi-Fi certification program after IEEE802.11n draft approval

July 2009

VMware inaugurates new development center in Pune, India

TSMC springing back to better days of semiconductor manufacturing

Signs of semiconductor industry's recovery to slow growth is seen in 2nd quarter of 09

ST Micro and Infineon's Q2 sales figures says semiconductor market is slowly growing

Teradici selects Synopsys' Galaxy and Discovery chip design tools

ARM Q2 revenue report indicate weak microcontroller, processor and semiconductor IP market

Austriamicrosystems to make Triad Semiconductor's 32-bit processor based SoC chips

ARM, Chartered, IBM, Samsung, and Synopsys joining hands to develop next level 32/28nm Mobile SoCs

NEC and Renesas merging process is time delayed by 1 month

IDT powered by Tundra's expertise is allying with Micron to develop PCIe SSDs

Broadcom broadening the use of Bluetooth

IC Validator from Synopsys supports TSMC's new design verification format

Mentor makes it's range of EDA tools to support new TSMC processes

Moser Baer and Philips settle a patent dispute

IC supporting environment and money saving mobile phone charging adapters

Semiconductor revenues from WiMax based Micro, Pico and Femtocells to grow at 260%

Q&A: The increasing role of FPGA in embedded systems and latest trends

Interoperable Process Design Kit jointly developed by Synopsys and TSMC

Slight growth in semiconductor equipment booking

Actel FPGA on-board NASA Lunar spacecrafts

Fujitsu Micro selects Digi-key to sell it's MCUs and other parts

Volterra Semiconductor 2Q revenue figures signals industry recovery

Trusted Logic and NXP semiconductor partner to sell bundled NFC solutions

New LTE handset certification platform from Aeroflex and w2bi

EU and Japan customers help KPIT Cummins to register a quarterly profit growth of 73%

Semiconductor can drive recession out but not vice-versa

Intel completes the process of Wind River acquisition

UL now has a new lab facility for solar testing in North America

STMicroelectronics formally launched Nano2012 research and development program

Magma's Talus based low-power reference flow available for SMIC 65-nm libraries

BSNL awarded US$77 million contract to Sterlite for building FTTH network

Bluetooth SIG is conducting Bluetooth application design contest

EDA industry revenues down in 1Q09 in all areas except Asia-Pacific

MediaTek and Samsung employ ARM's Mali in their chips and devices

Ericsson completes delivery of new GSM base station hardware to VodaFone Essar

Embedded and portable electronics saying bye bye to Intel x86 architecture

Sumitomo employs Stratix IV GX FPGAs in its LDPC system

Nanotechnology researchers at Berkeley Lab demo a low cost and flexible solar PV cell

Broadcom gave up the pursuit for Emulex

India; the blooming garden for semiconductor industry

Infineon sells its wireline communications business to U.S. Investor Golden Gate Capital

NXP's RFID chips and expertise tapped by Siemens for its pharmaceutical RFID sys

Philips interoperability test lab designed for testing of digital consumer systems' connectivity

Lab-on-chip VereFlu of Veredus Lab is successfully tested on Swine-Flu H1N1 samples

Peregrine Semiconductor and MagnaChip completed the qualification of UltraCMOS technology transfer

Achived News (Jan to June of 2009)

Achived News (2008, 2007, 2006)

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