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December 2009
MEMC Electronic
Materials acquire ownership stake in Eversol
GE and
Metso collaborates to resell Metso Device Asset Management
Solution
Tejas
Networks won Deloitte Tech Fast 500 Asia award fourth time
in a row
Ravi Swaminathan
appointed as MD and VP of Sales and Marketing for AMD India
Walden
C. Rhines to present keynote at the International VLSI Conference
in Bangalore
Mentor
received the IPv6 interoperability approval for its Nucleus
V.6 networking stack
Broadcom
reaches settlement in stock options class action lawsuit
SunEdison
and Xcel Energy wins a deal for five photovoltaic solar installations
in New Mexico
QSound
Labs join in the ARM Solution Center for Android
Avaya
completes the acquisition of Nortel Enterprise Solutions
Kyivstar
GSM selects Alcatel-Lucent to power all-IP network transformation
in Ukraine
Eurotech
wins 1.2M USD contract to supply embedded computers
Redbridge
deploy BridgeWave's gigabit multiple wireless links in its
video surveillance system
Infineon
and Fairchild Semiconductor settle patent dispute on power
transistors
PICMG
announced new specifications for CompactPCI and AdvancedMC
Year 2009
is not that bad for memory chip makers and 2010 going to be
even better
40nm 2-Gigabit
DDR3 SDRAM volume production shipment from Elpida
65nm XS
Version 1-Gigabit DDR3 SDRAM from Elpida
Biometric
security solution replaces passwords with the scan of an employee's
palm
Atmel
integrate Immersion's TouchSense touch feedback tech into
its touch devices
PICMG
adopts PICMG 2.30 for cPCI and AMC.4 specification for AdvancedMC
WD and
NEC partnered to raise USB 3.0 standard with new storage interface
tech
Fairchild
Semiconductor's LED driver drives OSRAM's LED products
Rambus
acquire GLT's patents on lighting and optoelectronics tech
Atmel
collaborates with H&D to deliver power efficient embedded
Wi-Fi solution
Not
to miss event on semiconductors; VLSI conf. on Jan 3-7 2010
in Bangalore
High power
three-phase bridge rectifier modules from Microsemi are DSCC
qualified
Sony and
RealD collaborated to offer immersive 3D home entertainment
ST
Micro engages solidly with Indian power semiconductor market
QNX Neutrino
RTOS supports Cavium's OCTEON Plus multi-core processors
Dell'Oro
Group reports high-speed server network soars in the third
quarter 09
Marvell's
ARMADA 1000 SoC won "Best Media Processor System-on-Chip"
Award
EMU In-Home
Display from Rainforest earns ZigBee Smart Energy product
certification
Over 500
million SmartMX security chip shipment from NXP semiconductor
ITM selects
Broadcom's Bluetooth tech for its hands-free car kits
Upgraded
tech from broadcom to enhance bluetooth and Wi-Fi co-existence
in notebooks
UMC presented
new hybrid high-k/metal gate tech for 28nm at 2009 IEDM
Dell'Oro
reports 10% of decline in China mobile infrastructure market
in third quarter 09
Dr. Tinku
Acharya is elevated to IEEE Fellow for his contribution to
image processing
MATLAB;
an essential tool for a serious engineer
Interaction
with Xilinx-India CTO on FPGA design issues and trends
XtremeData
deploy Altera's Stratix IV FPGAs into its dbX Analytics appliances
Digi-Key
to distribute Torex' power ICs
LSI and
Wichita State University launch Center for Storage Networking
Research
Alcatel-Lucent
increased its IP router market share by four percent
Premier
institutes MIT, Carnegie and Purdue joins cybersecurity research
consortium
Battery
less TV remote control from NEC and Soundpower
AMD and
SiSoftware collaborates to develop OpenCL GPGPU benchmark
suite
Elpida
receives "2009 Global Warming Prevention Activity Award"
Sogitec
certified AMD's synchronization modules and 3D graphics accelerators
India's
new solar mission opening a floodgate of opportunities
Mitsubishi
selects ADI's SHARC processor for its automotive digital process
center
AWR incorporates
AMPSA's multimatch amplifier design tech into its microwave
office
Towerstream
deploys BridgeWave's 80 GHz links into its WiMAX backhaul
network
Airspan's
WiMAX products are FCC certified
Panasonic
and SEAS-NVE collaborated to improve house energy usage remotely
Given
Imaging's camera capsules employs Zarlink's wireless RF chip
Broadcom
acquires Dune Networks to get into cloud computing
Epson
Imaging's TFT LCD business sales function transferred to the
Sony Group
e2v's
Centre for Electronic Imaging in collaboration with Open University
Automotive-grade
semiconductor manufacturing by TSMC
Record
level sales of PON equipment according to Dell'Oro report
"Understand
digital power in one day" hands-on technical seminar
by Intersil in Germany
November 2009
Surge
protection devices from Emerson meet UL safety standards without
need for modifications
Emerson
Network Power expands VME board portfolio with new ruggedized
models
MEMS microphones
from ST in the price range of electret microphones
3D Systems
acquires AdvaTech's manufacturing to extend its 3Dproparts
targeting military apps
China
Telecom selects Alcatel-Lucent to deploy first commercial
WAP & WEB Gateway
There
Corporation is new partner of Z-Wave Alliance
AeroScout's
Wi-Fi RFID solution powering Ultimo's hospital software
Infineon
and Nokia collaborated to develop advanced RF transceiver
solutions for HSPA
DENSO
designed and tested its robotic arms by using NI's measurement
tools
Mitsubishi's
LCD TV with Blu-ray disc recorder employs Marvell's Qdeo chips
Online
video-rich tutorial on DC power supply circuit design from
PI
Digi-Key
to sell Tusonix line of products from CTS
MEMC Electronic
Materials completes the acquisition of SunEdison
Researchers
can access MATLAB on TeraGrid
New Telefónica
HSPA+ network deployed with Sierra AirCard USB 307 modem in
Spain
Microsemi's
high power single-phase rectifier bridge modules are now DSCC
qualified
Mitel
Networks adds Microsemi's PowerDsine to its DataNet portfolio
Atmel
expands its 6-pin AVR Microcontroller family
Motorola
gains push-to-talk advantage by acquiring RadioFrame's iDEN
products
Austriamicrosystem
expands Multi Project wafer prototyping service
CDMA
and WCDMA patent arrangement agreement by MediaTek and Qualcomm
Roti maker,
bone screws, and website security wins Silicon Valley Entrepreneurial
Awards
Dune and
NetLogic validated the interoperability between their products
FormFactor
qualifies one-touchdown 300-mm wafer probe card for DRAM sort
test
Ericsson
announces completion of Nortel's acquisition in North America
EDGE Evolution
software from Ericsson adds 3G capabilities to GSM networks
12
design wins for Continuous Computing's DPI tech from network
equipment providers
YM Krishna
SSK produce renewable energy by employing GE Fanuc's control
system
FlashCORE
III programming solution from Data I/O wins 2009 global technology
Award
Mutare
selects Ditech's PhoneTag automated voicemail-to-text service
Hand gesture
based interface for remote control of TV
Toshiba
to expand use of Cadence tools for SoC design
TowerJazz
and Tanner EDA to deliver PDK for power management IC design
Aptina
did post layout verification of its image sensor design using
Fast 3D software
Toshiba
develops new photoresist tech for 20nm semiconductor fabrication
Toshiba
Semiconductor is transferring its chip assembly facility to
Nantong
Broadcom
supports WAPI in its WLAN ICs
NXP wins
Sanmina-SCI's best supplier award
Agilent's
new 1-Megawatt Solar Power System to save $3.5 million in
energy costs
Symmetry
to distribute Fujitsu's chip in Americas
Hynix Semiconductor's
2Gb DDR3 DRAM devices Validated by Intel
Semiconductor
equipment Book-to-Bill ratio above 1 from Jul to Oct 09
Semiconductor
packaging materials market to reach $20.1 billion by 2013
DRAM test
lab opened in Munich Germany
Cisco and
HP lead in fixed 10 Gigabit Ethernet switch segment
National
Micro. Institute names Powervation as best semiconductor startup
up of the year
Intel
invest to built 1000 times more powerful of current supercomputer
Westcode
Announces New 'Megawatt' press-pack IGBT transistors
Advanced
semiconductor chips at a price of a dollar and less
Semiconductor
revenue to drop by 11.4 percent in 2009: Gartner's reviewed
estimates
Learn about
LabVIEW at NI's conferences in Indian cities
Applied
Materials buys advanced semiconductor packaging expert Semitool
Digital
Imaging achieve first-pass silicon success in 22 days
Intel and
NEC join hands to develop supercomputer technologies
DNP, MPI
and Sony develop smartcard using biodegradable plastics
IP
and patents are the gold reserves of the semiconductor industry
Intel and
AMD race neck to neck in supercomputing domain
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