NeoPhotonics Corporation has announced the general availability of high power 1310 nm lasers and laser arrays qualified for use with low-cost, non-hermetic packages for 100G silicon photonics based QSFP28 modules in data center applications.|
With this, the need for custom high-power and non-hermetic laser sources to provide the light source for Silicon Photonics based transceivers used for 100 Gbps connections within the data center is addressed. Deployment of such transceivers in industry-standard “Multi-Source Agreement” formats such as CWDM4, CLR4 and PSM-4, predominantly in a QSFP28 form factor, is now underway. Each laser provides an efficient and high power light source designed around a specific implementation of Silicon-based high speed analog and digital electronic devices and related photonic components. These high power 1310nm CW DFB lasers are qualified to non-hermetic test compliance with Telcordia GR-468-CORE Issue 2, including damp heat testing for powered non-hermetic devices, and are production ready.
"These uncooled, high power non-hermetic CW DFB lasers and laser arrays are a critical component for any of the emerging 100G, 200G or 400G Silicon Photonics-based transceivers developed for data center switching applications," said Tim Jenks, Chairman and CEO of NeoPhotonics. “These new lasers effectively illustrate the wide ranging applications for our Advanced Hybrid Photonic Integration technology by efficiently combining our high optical power Indium Phosphide laser technology with our partner’s Silicon Photonics modulator technology to maximize link performance margins,” continued Mr. Jenks.
The laser developments from NeoPhotonics are focused on:
a. The need for high optical power output from 40mW to 70mW for both NRZ and PAM-4 modulation.
b. Fully qualified and reliable lasers in non-hermetic packages - making it possible to achieve the high volume and low cost necessary for mega-data center deployments.
c. The custom laser features help customers to use automated laser attach and alignment methods to increase volume and further reduce assembly costs.