The new high-density, stackable, 18-V input, 35-A synchronous DC/DC buck converter TPS546C23 from Texas Instruments has high- and low-side MOSFETs into a small-footprint package. Power supply designers can use two converters in parallel to drive loads up to 70 A for processors in space-constrained and power-dense applications in communication equipment, enterprise and cloud computing, and data storage systems.
Texas instruments says the TPS546C23 power converter is 44-percent denser (amperes per square millimeter) compared to similar devices from its competitors. TPS546C23 offers 0.5 percent reference-voltage accuracy over temperature and full differential remote-voltage sensing to meet the voltage accuracy requirements of deep sub-micron processors. The Power IC uses single-pad, stacked die, quad flat no-lead (QFN) package to deliver high-power in smaller package.
TI also provides the TPS546C20A PMBus converter that supports pin-strapping for both the output voltage and soft-start time.
The other features include On-chip PMBus interface and non-volatile memory, Voltage-control mode with clock frequency synchronization and input feed-forward improves EMI/noise, frequency synchronization to an external clock.
TPS546C23 is immediately available and is offered in a 40-pin, 5-mm by 7-mm by 1-mm PowerStack QFN package and is priced at US$4.62 in 1,000-unit quantities.