For sensor interface, a better DSP processor chip is made available by MegaChips. The eDSP from MegaChips is projected as a better alternative compared to microcontroller based sensor processing solution.
The sensor processing market is growing very fast due to explosive growth of both consumer IOT and industrial IOT. The sensor interface play an important role in medical electronics, industrial electronics, automotive, and the newly emerging agriculture/farming. These are all the applications which have high potential for IOT along with already happening smart home.
“Today’s out-of-the-box solutions are mainly designed for consumer applications and lack the flexibility or the performance required by system engineers for their high-end specialized applications,” said Michael Navid, VP of Business Development and Marketing at MegaChips. “They find themselves cornered into choosing among the less attractive, power hungry microcontroller-based designs, or the less flexible, off-the-shelf integrated sensor fusion solutions. When it comes to sensor fusion, there is no one size fits all, so we provide developers with an alternative platform through our eDSP product family with the flexibility to choose from a wide variety of external sensors and the freedom to implement their own differentiated fusion algorithms using our comprehensive development tool chain and reference design packages, reducing their time to market and cost.”
With a 32-bit programmable DSP core, the eDSP has 256K RAM for instruction, 256K RAM for data and number of interfaces. MegaChips claims its eDSP delivers four times higher performance with 98% less power than the ARM Cortex-M4F, and can execute 2.5 times faster than the Cortex M4 based designs complex mathematical algorithms such as Kalman filters, Matrix, and FFT calculations, typical benchmarks for the sensor fusion space, while providing a higher level of programmability and customization.
3-way VLIW (Very Long Instruction Word) and a 4-way floating point SIMD (Single Instruction Multiple Data) inside the DSP core makes intrinsic parallelism of most sensor fusion challenges easily overcome. The processor core also performs multi-way branching and conditional execution allowing programmers a fine grain control on concurrent instructions execution. This is more advanced way of processing compared to ARM Cortex like traditional processors.
The eDSP evaluation kit with the necessary software and documentation is provided by the MegaChips to quickly set up and use the platform.
eDSP is available now in a compact 3.5mm X 3.5mm FBGA-49 package with an operating temperature range of -40° to +85°C. For more information, contact MegaChips at 408-570-0555, or visit http://www.megachips.com/products/sensor-hub/index.htm