Not only smart phones and wearables, now the cars need multiple high resolution cameras, where CMOS image sensor need to be connected to the SOC chips and embedded boards, to encode the image into digital data and also to process further. For the electronics designer, its a complex job to connect and place image sensors and chips to achieve the video data quality and integrity. Though MIPI CSI-2 interface comes handy in connecting camera to other devices on the board and outside the board. The Transmission distance between the camera and processor is an issue, that's been solved by the new chip from THine Electronics. The new AEC-Q100 (Grade 2) compliant single chip provides 50x increase in maximum transmission distance – from 30cm to 15m. The high-definition (1080p60, 4K2K) supporting integrates the MIPI CSI-2 interface with THine’s V-by-One HS product family.
The other supported features include Uncompressed real-time, zero latency video transmission, 360 degree rotation at an affordable price point, Lower BOM cost, Smaller circuit boards for more compact designs, new product form factors and higher reliability.
A good example given by Thine in the release is for automotive application where inside cars, a clear rear view image can be displayed anywhere inside the car without compression-induced latency.
“We are excited to release our MIPI interface products worldwide,” said Kazutaka Nogami, CEO of THine. “By working with hundreds of real world designs, we have refined our video processing and networking technologies. Combining MIPI and V-by-One HS enables design engineers create affordable, high performance next generation camera and industrial vision designs.”