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Date: 07-11-16

Telit develops Intel Atom SoC based IoT Module supporting 3G, Wi-Fi, BT

Telit introduces Intel Atom based IoT modules WE922-3GR and HE922-3GR featuring 3G Cellular, Wi-Fi, Bluetooth and GNSS in a single module. Telit leverages the quad-core processing power of Intel atom to provide enough amount of processing power inside this IoT module to target markets such as healthcare, vending, POS, public parking, smart buildings which also covers smart cities, smart grid used in electricity, power management and industrial internet of things. "The xE922-3GR products are game changers. When you look at how complexity of designing devices with multiple chipsets is impacting cost and time-to market, you can appreciate the power of these all-in-one hybrid modules," said Ronen Ben-Hamou, Telit Executive Vice President of Products and Solutions. "It would take a good engineering team months to develop an IoT device prototype using disparate chips, whereas an engineer or two can now create a complete end-to-end IoT solution in just couple of weeks". "Across all industries and segments, businesses are always looking for shortcuts in traditional product development to get to market faster." said Fred Yentz, Chief Executive Officer, Telit IoT Platforms. "With the combination of Telit's Cloud-ready IoT modules, custom data plans, comprehensive IoT Portal, and unmatched IoT Know-How, we make it easy to connect, manage and integrate your ?things? with web-based or mobile apps or enterprise systems ? providing the fastest path to business transformation, improved operational efficiencies and innovation in the market." Following are the detailed technical specifications of this module: 1. With a 34x40mm LGA footprint, the WE922-3GR and HE922-3GR deliver unparalleled features for their size. 2. Both modules include 2.4GHz Wi-Fi 802.11 b/g/n and Bluetooth 4.0 LE. 3. The embedded global positioning receiver in the modules is compatible with GPS and GNSS constellations. 4. Both of them integrate the functionality of an entire processor board inside the 441-pin package based on the 1.2GHz, 64-bit, quad-core Intel Atom? x3 processor series and include 8GB memory, sensor inputs, battery charger logic, analog speaker and microphone audio connections, interface for primary and secondary cameras and direct support for high-resolution display with touch screen and/or keyboard. 5. The application development environment is based on Android and Yocto Linux enabling access and reuse of vast libraries of functions and applications across all industries and segments. 6. In addition to all of the above features, the HE922-3GR includes quad-band HSPA+ cellular connectivity delivering 21Mbps download data rate with fallback to 2G. 7. The 3GPP Release 7 compliant HE922-3GR module supports 850/900/1900/2100MHz 3G HSPA+ bands with 850/900/1800/1900MHz 2G. The upload data rate is 5.76Mbps. These are available in two environmental grade variants. The commercial grade can operate in the temperature range of 0°C to +70°C; the extended grade can operate in the temperature range of -40°C to +85°C. These modules can be connected to SD card and provide connections for a USB 2.0 port with OTG, two UART and SPI ports and I2C support. Telit is also providing a developers' kit including high-resolution touch screen with embedded cameras and audio, antenna and power supply for quickly developing whatever hardware one wishes to develop.

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