Now you have a small form-factor FPGA based System on Module from Trenz Electronic. The FPGA chip used in the new TE0808 UltraSoM+ is the popular Zynq UltraScale+ MPSoC. Measuring 52mm x 76mm, the TE0808 UltraSoM+ targets multiple markets such as automotive, broadcast, communications, industrial, medical, mil/aero, and T&M markets for use in applications such as 5G wireless, advanced driver assistance systems (ADAS), and industrial IoT applications. Suggesting for processing loads such as graphics and video pipelining and also as dedicated processing blocks.
The TE0808 has 4GB of DDR4 SDRAM main memory with 32-bit width, up to 512MB of Flash memory for configuration and operation, and assembly options to add additional volatile or non-volatile memory. Supported are Micron XTRMFlash and Spansion/Cypress HyperRAM or HyperFlash devices. Also integrated is an onboard switch-mode power delivery subsystem that includes 14 DC/DC converters and 13 LDO regulators controlled by an ultra-low power MCU to provide flexible power-saving modes. Rugged board-to-board stacking connectors provide a total of 480 terminals supporting high-speed transceiver I/O’s to the processing system and programmable logic in the FPGA part. An ultra-low jitter PLL provides all required clocks to the 20 serial transceivers.
The board features connectivity options, DSP architectural blocks, on-chip memory, and programmable logic capacity. Company also to offer UltraITX+ companion baseboard enabling TE0808 UltraSoM+ to be installed in standard PC enclosures.
“The TE0808 UltraSoM+ is the first implementation of the Zynq UltraScale+ MPSoC in a system-on-module,” said Thorsten Trenz, CEO of Trenz Electronic. “In many ways, the technological advantage it delivers is so significant that it is hard to scope. It gives design engineers the technical edge they have been looking for as they grapple with the significant demands of developing the next generation of multi-tasking embedded systems.”
“The TE0808 UltraSoM+ is a truly innovative implementation of our Zynq UltraScale+ MPSoC,” said Mark Jensen, Director of Corporate Software Strategy & Marketing, Xilinx. “With Zynq UltraScale+ MPSoC technology at the heart of Trenz’s TE0808 UltraSoM+ system-on-module, designers will benefit from unparalleled flexibility, dramatically lower BOM costs, and overall project acceleration for complex embedded designs.”