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Date: 07-02-16

Arteris announces 9 new IP licensees in 2015

Arteris said it has added nine new licensees for Arteris FlexNoC Interconnect IP. The new customers for Arteris customers added during 2015 include SK Hynix, ZTE, Beijing Pinecone, Sequans Communications, Montage Technology, Blu Wireless Technology, and some more undisclosed automotive and consumer electronics customers.

Arteris claims large number of application processor or digital baseband modem used in smart phones are using Arteris FlexNoC interconnect IP.

K. Charles Janac, President and CEO, Arteris said "2015 was an exciting year for Arteris and its semiconductor IP customers. As of December of 2015, there were 101 Arteris-connected SoC designs produced or currently in production, manufactured in a variety of silicon process from 65nm down to 14nm. Also, 2015 was the first year that Arteris has been designed into in SoCs using 10nm processes."

Arteris delivered two announced new products in 2015: FlexNoC Resilience Package for automotive and industrial applications requiring reliability and safety, and FlexNoC Physical for automated timing closure and physical constraint management at the architectural level. Both new products were licensed by customers and deployed on production SoC projects in 2015. Geographically, the largest design win customer traction came from Asian semiconductor and system houses. In addition, Arteris delivered four new quarterly customer releases for its flagship FlexNoC Interconnect product in 2015, shared by Arteris in its latest release.

“If you own a smart phone, chances are the application processor or digital baseband modem is built with Arteris FlexNoC interconnect IP,” said K. Charles Janac, President and CEO of Arteris. “Mobility was the first market to demand the semiconductor improvements in SoC power consumption, performance and area (PPA), in addition to lower R&D and unit costs, that are enabled by using Arteris IP. Now these benefits are demanded by our automotive, IoT and industrial customers, in addition to advanced features like SoC reliability for increasing the functional safety of mission critical electronics systems. We look forward to delivering additional interconnect IP product innovation in 2016”.

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