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Date: 06-08-15

ST unveils DOCSIS 3.1 chipset made using 28nm FD-SOI

STMicroelectronics, being a long supporter of DOCSIS technology and also leading vendor of STB/cable media access/control semiconductor technology has announced the STiD325 (codenamed Barcelona), its DOCSIS1 3.1 chipset for Broadband CPE2 Cable Modems, embedded Media Terminal Adapters (eMTAs), and Gateways, and also for Video Gateways when associated to set-top-box chipsets. These chips are demonstrated at CableLabs Summer Conference, August 2-5, 2015 in Keystone, Colorado, USA.

DOCSIS 3.1 by CableLabs enables multi-gigabit data on existing Hybrid Fiber-Coax (HFC) networks through improved spectral efficiency using OFDM3 multi-carrier modulation combined with low-density parity-check-based Forward Error Correction.

“Prepared to be among the first commercial DOCSIS 3.1 deployments, our innovative platform architecture supports our ambition to make Barcelona a reference in the Cable industry,” said Philippe Notton, Group Vice President and General Manager of STMicroelectronics’ Consumer Product Division. “As a standalone for multi-gigabit cable gateways or combined with our Monaco SoC for an UltraHD media gateway, ST can offer complete solutions for fast design.”

Barcelona is fully compliant with the DOCSIS 3.1 specification, including:
Two 196 MHz OFDM downstream channels;
32 single-carrier DOCSIS 3.0 QAM4 downstream channels;
Two 96 MHz OFDM-A upstream channels;
8 single-carrier DOCSIS 3.0 QAM upstream channels.

ST shared the below features of Barcelona:
Very high performance using multiple 64-bit ARM® CPUs to deliver >10K DMIPS, line-rate networking support on every port, and hardware acceleration for routing and switching, allowing Multiple System Operators (MSOs) to build future-proof CPE platforms with plenty of headroom to support the field introduction of new services;
Backward compatibility with DOCSIS 3.0 32x8 to allow a smooth, cost-effective transition to DOCSIS 3.1;
Flexible architecture facilitating independent software development and software upgrades with minimal coupling between stacks, as well as the introduction of new features like home surveillance and home automation; support of various Wi-Fi configurations;
28nm FD-SOI silicon technology, providing outstanding power efficiency at all operating levels, including fan-less designs, along with highly-efficient RF and analog integration.

Currently sampling to lead customers, Barcelona comes with pre-integrated RDK-B software, including DOCSIS and Packet-Cable stacks.

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