Mitsubishi Electric unveiled new J1-Series high-power semiconductor modules featuring compact 6-in-1 packages mainly for use in electric and hybrid vehicles.
Mitsubishi to exhibit these modules at Power Conversion Intelligent Motion (PCIM) Europe 2015 event going to be held in Nuremberg, Germany from May 19 to 21 and the Automotive Engineering Exposition in Yokohama, Japan from May 20 to 22, and PCIM Asia 2015 in China from June 24 to 26.
Mitsubishi is supplying power semiconductor modules for electric and hybrid cars/ vehicles since 1997 and it says the demand for these modules had grown as sales of electric vehicles is also growing.
The new high-power J1-Series modules are compact and takes lesser footprint and are suggested as highly reliable for use in inverters of electric and hybrid vehicles.
Some of the other technical highlights/ benefits compared to previous generation products include:
Seventh-generation CSTBT chip technology enables collector-emitter saturation voltage to be reduced by about 10% compared to 2-in-1 J-Series T-PM
Direct cooling package with cooling fin improves heat radiation by about 30% compared to 2-in-1 J-Series T-PM (CT300DJH120) mounting power modules on Al fin by way of thermal grease.
Suppresses surge voltage through internal inductance reduction
Low-inductance package adopted for high-frequency switching applications.
Internal inductance reduced by about 30% compared to 2-in-1 J-Series T-PM (CT300DJH120).