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Date: 10-03-15

e2v inc releases the highest density MRAM device

e2v inc release stacked-package 32Mb MRAM-based product. EV5A16B is a stacked device with two 16Mb MRAM devices from Everspin Technologies and is offered in a 54 pins stacked-package TSOP. Available in commercial (0°C to 70°C) and Industrial (-40°C to 85°C) temperature ranges, the MRAM technology offers SRAM-compatible, 35-ns read/write timing with data retention and endurance and is used with microprocessors, DSP, storage systems, instruments, and FPGAs. Brad Little, Vice President and General Manager of e2v inc’s Semiconductor business unit commented, “Our new stacked-package MRAM will have a significant impact on our customers’ systems by addressing the industry requirements for a high-density memory, available in a small footprint with the ability to increase system performance. By improving the size, weight and power (SWaP) of our product you are also talking about major cost savings for the customer.” The new EV5A16B is available now.

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