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Date: 13-09-14

iNEMO ultra 3-axis accelerometer 3-axis gyroscope in SiP for wearble and IoT

STMicroelectronics developed first iNEMO Ultra product - an always-on, high-performance 6-axis combination accelerometer and gyroscope for designing battery-powered smart sensor systems to be embedded in mobile and wearable devices and innovative objects for the Internet of Things (IoT).

2.5mm x 3.0mm x 0.8mm measuring iNEMO Ultra 6-axis inertial-sensor combo (3-axis accelerometer/3-axis gyroscope) features high noise performance and 20% more energy-efficiency than the best alternative combos in low-power mode, claims ST.

ST explains "This is in part, due to the market’s largest "smart" FIFO (First-In First-Out) memory (8kbytes) — at least 2 times larger than any else available. This flexible memory allows the LSM6DS3 to save and batch more data before waking up the system processor, saving overall system power, too. Moreover, ST has leveraged its robust and mature manufacturing processes for the production of its industry-leading micro-machined accelerometers and gyroscopes, while manufacturing its IC interfaces using CMOS technology. This choice supports trimming of dedicated circuits to better match sensing-element characteristics."

"Our new 6-axis ultra-combo is designed to operate at the lowest power and best noise density in the market and will make Internet-of-Things devices far more efficient and convenient," said Benedetto Vigna, ST Executive Vice President and General Manager of the Analog, MEMS & Sensors Group. "With this latest addition to our industry-leading portfolio, our mastery of our own full supply chain, and the expertise and leadership to build system-level efficiency into everything we make, ST continues to raise the bar for motion-sensor performance."

The LSM6DS3 is a SiP offering integrated power-efficient modes down to 0.6mA in always-on working mode.

The LSM6DS3's event-detection interrupts enable efficient and reliable motion tracking and context awareness that is implemented in hardware. This allows for recognition of free-fall events, 6D orientation, tap and double-tap sensing, activity or inactivity, and wake-up events. LSM6DS3 designed to efficiently process real, virtual, and batch-mode sensors, saving power and enabling faster system reaction time. LSM6DS3 supports implementing in hardware Significant Motion, Tilt, Pedometer Functions, and Time Stamp, and to support the data acquisition of an external magnetometer with both hard and soft iron correction.

LSM6DS3 also offer hardware flexibility to connect pins with different mode connections to external sensors to fulfill additional functionalities as a sensor hub, auxiliary SPI (Serial Peripheral Interface), and other vital capabilities.

The LSM6DS3 combo will be available in Q4 2014.

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